Memory Device Light Guide and Heat Dissipation Structure
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Solution Overview
Problem
Conventional memory devices face challenges in heat dissipation and light beam guidance due to the placement of light guide elements, which restrict heat dissipation and limit the optical path of light beams, leading to increased temperatures and suboptimal lighting effects.
Innovation Solution
A memory device design featuring a substrate with a heat dissipation structure and a light guide element, where the light guide element is assembled with or locked on the heat dissipation structure, allowing light beams to pass through channels and be centralized or distributed, enhancing heat dissipation and lighting effects by adjusting the guiding path and luminance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the light guide element is disposed on the substrate to cover the light emitting diodes, then the light emitting diodes are covered and surrounded, but the heat generated by the light emitting diodes cannot be dissipated easily and the temperature of the overall memory device increases
Solution Approach 1:
The light guide element is divided into a first light guide element and a second light guide element that are disposed at different locations. The first light guide element covers the light emitting diodes for illumination, while the second light guide element is disposed away from the light emitting diodes to allow heat dissipation. This segmentation allows the system to simultaneously achieve both light coverage and effective heat dissipation.
2Strength
If the heat dissipation structure surrounds and clamps the light guide element and substrate, then the components are fixed together, but the light beams emitted by the light emitting diodes are restricted and the optical path is limited
Solution Approach 1:
The heat dissipation structure is designed with different local properties: it has clamping portions that provide strong fixing strength to secure the substrate and light guide elements, while simultaneously incorporating light-transmissible regions that allow light beams to pass through unrestricted. This local differentiation enables the heat dissipation structure to perform both mechanical support and optical guidance functions effectively.
3Illumination intensity
If the light guide element is disposed near the light emitting diodes for covering, then the lighting effect is achieved, but the optical path is limited by the light-transmissible regions and the lighting effect is suboptimal
Solution Approach 1:
The patent introduces a second light guide element disposed at a different spatial location (away from the light emitting diodes) to create additional optical paths. This dimensional arrangement allows light beams to reach different regions of the memory device through multiple pathways, enhancing the overall lighting effect and providing greater optical path flexibility without compromising the primary lighting function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively enhances heat dissipation and lighting effects by allowing unrestricted light beam guidance and improved heat transfer, overcoming the limitations of conventional technologies.
Implementation Method 1
the heat dissipation structure is partially connected with the substrate... effectively increase the heat dissipating performance of the overall memory device
Implementation Method 2
After light beams generated by the plural light-emitting elements pass through the at least one channel, the light beams are centralized or distributed on the light guide element
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
A memory device (20) includes a substrate (21), a heat dissipation structure (231) and a light guide element (24). The substrate (21) includes a storage module (213), plural light-emitting elements (212) and a connection interface (211). A first connection part (2111) and a second connection part (2112) of the connection interface (211) are respectively disposed on a first substrate surface (21 c) and a second substrate surface (21d), located near a first lateral side (21 a) of the substrate (21) and electrically connected with an electronic device. The heat dissipation structure (213) is partially connected with the substrate (20). The light guide element (24) is assembled with or locked on the heat dissipation structure (231), and located near a second lateral side (21b) of the substrate (21). At least one channel is formed between the heat dissipation structure (231) and the substrate (21). After the light beams of the light-emitting elements (212) pass through the channel, the light beams are centralized or distributed on the light guide element (24).