Memory Fin Stack Heat Dissipation for Sustained Data Throughput
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Solution Overview
Problem
Existing memory sub-systems face challenges in efficiently managing data throughput and heat dissipation, leading to performance throttling due to heat build-up, which is exacerbated by the need for large heat sinks that violate PCB space restrictions.
Innovation Solution
Implementing a fin stack thermally coupled to memory components via a ground layer of the PCB to dissipate heat without violating height restrictions, acting as a remote heat sink to maintain optimal operating temperatures and prevent throughput throttling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large heat sinks are used to dissipate heat from memory components, then heat dissipation capability is improved, but PCB space restrictions are violated
Solution Approach 1:
The patent transitions from planar heat dissipation structures to vertical three-dimensional fin stacks. The heat sink fins extend vertically from the PCB surface in the Z-dimension, allowing significant heat dissipation surface area without consuming additional PCB footprint space. This dimensional change resolves the contradiction between heat dissipation capability and PCB space utilization.
Solution Approach 2:
The fin stack structure is integrated within the existing PCB assembly footprint. The heat sink fins are positioned vertically above the memory components and controller, nesting the heat dissipation function within the same horizontal space rather than requiring separate dedicated area, thus maintaining compact form factor while improving thermal management.
2Productivity
If data throughput is increased in memory sub-systems, then productivity is improved, but heat build-up increases causing performance throttling
Solution Approach 1:
The fin stack acts as an intermediary thermal management component between the heat-generating memory components and the ambient environment. By providing an enhanced heat transfer pathway through the vertical fin structure, it enables sustained high data throughput operations without excessive heat build-up that would trigger throttling, thus resolving the contradiction between productivity and temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fin stack effectively manages heat dissipation, prolonging the time to reach threshold temperatures, thereby maintaining optimal data throughput and reducing physical resource consumption.
Implementation Method 1
a fin stack thermally coupled to the set of memory components and the processing device
Data Source
AI summary
Aspects of the present disclosure configure a memory sub-system processor to use a fin stack to improve heat dissipation to improve a data transfer rate. The processor measures temperature of at least one of the processing device or the set of memory components. The processor accesses a reference temperature for controlling data transfer rate between a host and the set of memory components. The processor compares the measured temperature with the reference temperature and, based on the comparison, adjusts the data transfer rate based on comparing the measured temperature with the reference temperature.