3D Memory Staircase Isolation Structure for Higher Yield
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Solution Overview
Problem
The manufacturing process of three-dimensional memory devices faces challenges with increasing storage density and integration, leading to decreased yield and lack of supporting force during production.
Innovation Solution
A memory device design incorporating a lower support member and a method for manufacturing, which includes a stacked structure with a lower isolation structure and support members to enhance structural integrity, using conductive layers separated by isolation structures and support members to provide additional support in the staircase region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If storage density and integration of 3D memory devices are increased, then storage capacity is improved, but manufacturing difficulty increases and yield decreases
Solution Approach 1:
The lower support member is formed in advance during the manufacturing process, before subsequent processing steps. This preliminary structural reinforcement prevents deformation of the stacked structure during later manufacturing operations, enabling higher storage density to be achieved without compromising manufacturing yield.
Solution Approach 2:
The support structure is segmented into multiple components: lower support members positioned in the staircase region and upper support members positioned in the array region. This segmentation allows targeted reinforcement at different locations, providing comprehensive structural support throughout the device while maintaining manufacturing feasibility.
2Quantity of substance
If storage density and integration of 3D memory devices are increased, then storage capacity is improved, but manufacturing yield decreases
Solution Approach 1:
The lower support member is formed early in the manufacturing sequence, establishing structural integrity before subsequent processing steps that could cause deformation. This preliminary reinforcement ensures higher manufacturing yield by preventing defects during production of high-density devices.
Solution Approach 2:
The lower support member acts as a cushioning element that prevents deformation and collapse of the stacked structure during manufacturing. By providing this protective support in advance, the manufacturing yield is improved as structural defects are prevented rather than corrected.
3Stability of the object's composition
If additional support structures are added to prevent deformation, then structural stability is improved, but device complexity increases
Solution Approach 1:
Support members are strategically placed only in specific regions where they are most needed: lower support members in the staircase region and upper support members in the array region. This localized approach provides necessary structural stability without adding complexity throughout the entire device structure.
Solution Approach 2:
The support members serve multiple functions simultaneously: they provide structural stability to prevent deformation, act as isolation structures to electrically separate conductive layers, and serve as formation templates during manufacturing. This multi-functionality reduces overall device complexity by combining multiple structural elements into unified components.
Data Source
AI summary
A memory device includes a stacked structure having an array region and a staircase region adjacent to the array region, a lower isolation structure in the stacked structure, two memory strings in the array region and at least one lower support member in the staircase region. The stacked structure includes conductive layers. The lower isolation structure has an upper surface in a lower portion of the stacked structure, extends from the array region to the staircase region and separates one conductive layer into a first conductive strip and a second conductive strip electrically isolated from each other and electrically connected to two memory strings respectively. A material of the lower support member is the same as a material of the lower isolation structure, and a height of the lower support member is the same as a height of the lower isolation structure.