Memory Module Assembly With Defect Data Storage
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Solution Overview
Problem
Existing methods for managing defective memory cells in memory devices often require computing systems to devote resources to detecting and skipping these defects during operation, which can be inefficient and may not utilize all available memory devices effectively.
Innovation Solution
A method and system for assembling memory modules that involves testing memory devices for defective cells before assembly, storing defect data in a persistent store, and selecting devices to ensure that defective cells are located within specific memory blocks, allowing for more controlled assembly and utilization of memory modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If memory devices are tested and sorted based on defective locations before assembly, then the reliability of memory modules is improved, but the manufacturing complexity and time are increased
Solution Approach 1:
The patent applies preliminary action by testing and identifying defective memory locations in individual memory devices before they are assembled into memory modules. The defect data is stored in a database, and memory devices are pre-sorted into different groups based on their defect patterns. This allows the assembly process to selectively combine devices in a way that concentrates defects in specific memory blocks, thereby improving overall module reliability without requiring perfect individual devices.
Solution Approach 2:
The patent implements local quality by creating memory modules with non-uniform defect distribution. Instead of requiring all constituent devices to be defect-free, the system deliberately places devices with defects in specific locations such that defective memory blocks are concentrated in certain areas of the module. This allows defect-free or less-defective regions to be utilized effectively, improving overall module reliability while accepting localized defect concentrations.
2Reliability
If defective memory devices are discarded, then the reliability of memory modules is improved, but the productivity and resource utilization are reduced
Solution Approach 1:
The patent converts the harm of defective memory devices into a benefit by systematically utilizing them in memory module assembly. Instead of discarding devices with defects, the system tests them, records defect locations, and strategically assigns them to specific positions in memory modules where their defective blocks can be isolated. This approach transforms previously unusable defective devices into functional components, significantly improving productivity and resource utilization while maintaining acceptable reliability through controlled defect placement.
3Manufacturing precision
If memory devices are tested individually before assembly, then the defect management precision is improved, but the manufacturing time and cost are increased
Solution Approach 1:
The patent performs preliminary testing of individual memory devices to identify and record defective block locations in a database before assembly. This upfront investment in testing time enables precise defect tracking and facilitates efficient subsequent assembly operations. By knowing exactly where defects are located in advance, the assembly process can be optimized to quickly combine devices without requiring extensive retesting or inspection of the final module, thereby reducing overall manufacturing time despite the initial testing overhead.
Data Source
AI summary
Embodiments described herein relate to systems and methods for testing and assembling memory modules. In at least one embodiment, the method comprises: assembling a memory module, the memory module comprising at least one memory device having one or more defective memory locations; wherein the assembling comprises storing the data that identifies the one or more defective memory locations on the memory device in a persistent store on the memory module, wherein the memory module comprises a microprocessor and persistent memory associated with the microprocessor, and wherein the persistent store on the memory module comprises the persistent memory associated with the microprocessor.