High-Temperature Semiconductor Memory Module Testing With Dual-Fan Control

The patent applies dynamics by making the temperature control system adjustable and adaptive. The controller dynamically adjusts the heater power output based on real-time temperature feedback from the memory module, allowing the system to adapt to different self-heating characteristics of various memory module capacities. This transforms a static heating chamber into a dynamic control system that can maintain precise temperature control for both low-capacity and high-capacity modules.

The patent implements feedback control by continuously monitoring the memory module temperature through a temperature sensor and using this information to adjust the heater power. The controller receives temperature data from the module and automatically modifies heating intensity to maintain the target temperature, enabling fine temperature adjustment for high-capacity modules while keeping the system relatively simple through automated closed-loop control.

The patent uses feedback control to prevent temperature overshoot. The temperature sensor continuously monitors the memory module temperature and feeds this information to the controller, which adjusts the heater power in real-time. When the module temperature approaches or exceeds the target range (especially for high-capacity modules with high self-heating), the controller automatically reduces or stops heating, ensuring reliable temperature range control.

The patent applies partial action by providing heating only when and where needed. Rather than continuous full-power heating, the system delivers partial heating cycles adjusted according to the module's actual temperature needs and self-heating characteristics. This prevents excessive temperature rise while maintaining the target temperature range.

The patent achieves universality by designing a temperature control system that can effectively test both low-capacity and high-capacity memory modules. The controller adapts its heating strategy based on the module type: for low-capacity modules with low self-heating, it applies stronger and more continuous heating, while for high-capacity modules with high self-heating, it uses reduced and more precisely controlled heating. This multi-functional capability allows a single device to serve diverse testing needs.

The patent applies dynamics by making the heating control adaptive to different module capacities. The system dynamically adjusts heating intensity and control frequency based on the specific thermal characteristics of the memory module being tested, enabling effective testing across the full range from low-capacity to high-capacity modules with varying self-heating properties.