Memory Module Interface Chip Adapting to Bus Width via Interposer
Solution Overview
Problem
Existing memory modules require replacement of IO chips and interposer substrates to match different data bus widths, leading to increased manufacturing costs and inefficiencies.
Innovation Solution
A memory module design where a memory core chip is placed between an interface chip and an interposer chip, with the interposer chip transmitting type-information to the interface chip via relay wires, allowing the interface chip to control the memory core chip based on its type, eliminating the need for chip replacements when data bus widths change.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the IO chip is replaced together with the interposer substrate in accordance with the data bus width, then the data bus width compatibility is improved, but the manufacturing cost increases
Solution Approach 1:
The interposer substrate is designed to support multiple data bus widths (4-bit, 8-bit, etc.) through a universal structure with pad electrodes arranged to accommodate different bus configurations. This allows a single interposer substrate to serve multiple functions across different memory module specifications, eliminating the need for separate substrates for each bus width and thereby reducing manufacturing costs while maintaining adaptability.
2Ease of manufacture
If the IO chip is fixed to a specific data bus width, then the manufacturing process is simplified, but the adaptability to different memory chip types is reduced
Solution Approach 1:
The IO chip incorporates dynamic configuration capability through software or hardware controls that allow it to adapt its operational parameters to match different data bus widths and memory chip types. This dynamic adaptability enables a single IO chip design to work with multiple memory chip configurations without requiring physical replacement or complex manufacturing variations, thus maintaining manufacturing simplicity while enhancing adaptability.
3Reliability
If through-electrodes are provided in the IO chip, then signal transmission capability is improved, but the manufacturing complexity increases
Solution Approach 1:
The interposer substrate acts as an intermediary between the IO chip and the memory chips, providing the through-electrode functionality at the substrate level rather than requiring through-electrodes within the IO chip itself. This mediation allows the IO chip to maintain a simpler structure while still achieving reliable signal transmission through the interposer's through-electrode network, thereby reducing IO chip manufacturing complexity while preserving signal transmission capability.
Data Source
AI summary
A memory module of the present invention is provided with a memory core chip that is placed between an interface chip and an interposer chip and has a relay wire for electrically connecting these chips, an interposer chip that transmits type-information, that is information showing the type of the memory core chip, to the interface chip through the relay wire, and the interface chip that controls the memory core chip in accordance with the type-information received from the interposer chip.