Memory Module Interposer Chip Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing memory modules face challenges with mechanical strength due to thin semiconductor chips and thermal strains caused by differences in thermal expansion coefficients between chips, leading to potential breakage and heat-related failures.
Innovation Solution
A memory module design incorporating a heat dissipating plate near the interface chip and an interposer chip with a semiconductor substrate similar to the memory core chip, along with a resin tape or substrate, to enhance mechanical strength and prevent thermal distortions, while allowing for efficient heat dissipation and high-density external connection terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If chip thickness is reduced to decrease memory module thickness, then the overall module size is reduced, but the mechanical strength of the chip deteriorates and breakage risk increases
Solution Approach 1:
A support substrate is adhered to the back surface of the chip before the chip is mounted on the memory module. This support substrate acts as a cushioning element that prevents chip breakage during bump bonding and thermo-compression bonding processes, enabling the use of thinner chips without compromising mechanical strength.
2Quantity of substance
If multiple chips are laminated to increase memory capacity, then the memory function is improved, but heat generation increases and thermal management becomes more difficult
Solution Approach 1:
A heat dissipating plate is introduced as an intermediary component between the chips and the external environment. This plate provides a dedicated thermal conduction path that efficiently transfers heat away from the laminated chips, preventing heat accumulation and enabling higher memory capacity without excessive temperature rise.
3Adaptability or versatility
If chips with different thermal expansion coefficients are used, then device functionality is improved, but thermal strains occur during operation
Solution Approach 1:
The support substrate is made of a material having a thermal expansion coefficient similar to that of the chip. This material homogeneity in terms of thermal expansion properties prevents thermal strains from occurring during heating or cooling cycles, maintaining the structural integrity and reliability of the memory module.
4Strength
If support substrate material is selected for mechanical strength, then chip protection is improved, but thermal expansion mismatch with chip increases
Solution Approach 1:
The support substrate is specifically selected to have both adequate mechanical strength for chip protection and a thermal expansion coefficient that matches the chip material. This balanced material selection ensures that the substrate provides structural support without causing thermal expansion mismatch issues during temperature variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases mechanical strength and thermal stability, preventing chip breakage and heat-related failures, enabling thinner chip lamination and efficient heat dissipation, thus improving the reliability and performance of the memory module.
Implementation Method 1
a heat dissipating plate is provided in closest proximity to the interface chip of the memory core chip, the interface chip, and the interposer chip
Implementation Method 2
placing the memory core chip on the surface of the interface chip on which the bump is formed, and thermo-compression bonding the bumps of the interface chip and the memory core chip to each other
Data Source
AI summary
A memory module of the present invention has a memory core chip for storing information, an interface chip for controlling data input/output, an interposer chip for transmitting/receiving data to/from the outside, and an external connection terminal provided in closest proximity to the interposer chip. A heat dissipating plate is provided in closest proximity to the interface chip. The interposer chip has a substrate made of a semiconductor material that is similar to the memory core chip, a land for holding the external connection terminal, a wire connected to the external connection terminal, and an insulating film for insulating the wire. The land, wire, and insulating film are integrally formed on one surface of the interposer chip.