Memory Package Redundant Die for Defective Cell Remapping
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Solution Overview
Problem
Existing memory devices face challenges due to manufacturing defects leading to defective memory cells, which are often addressed by fixed redundant memory that can result in unused capacity and increased array size, limiting flexibility and efficiency.
Innovation Solution
Incorporating an additional die with redundant storage in the memory package to supplement and replace redundant memory in the array, allowing dynamic remapping of defective cells and optimizing storage utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fixed redundant memory is included in the memory array to replace defective cells, then reliability is improved, but the memory array size increases and storage efficiency decreases
Solution Approach 1:
The patent separates the redundant storage function from the main memory array by introducing an additional die. The memory array is segmented into primary storage and the additional die contains dedicated redundant storage, allowing the array itself to remain compact while still providing repair capabilities for defective cells.
Solution Approach 2:
The additional die acts as an intermediary between the memory controller and the main memory array. It receives address signals, determines whether remapping is needed, and either redirects accesses to redundant locations or passes through normal accesses, thereby enabling repair functionality without expanding the core array.
2Reliability
If fixed redundant memory is allocated in the memory array, then defective cells can be repaired, but storage capacity is reduced due to unused redundant space
Solution Approach 1:
The patent implements dynamic remapping where the additional die determines at runtime whether an address needs to be redirected to redundant storage. This allows the system to adaptively use redundant space only when defective cells are encountered, rather than permanently allocating fixed redundant capacity that reduces overall storage availability.
Solution Approach 2:
The system changes the operational parameters of memory addresses dynamically. When a defective cell is detected, the address mapping parameters are changed to redirect access to redundant storage locations in the additional die, while normal operations use the original address space, maximizing usable capacity.
3Productivity
If additional redundant storage is integrated into the memory package, then yield is enhanced and array size is reduced, but device complexity increases
Solution Approach 1:
The patent adds redundancy in a dimensional sense by introducing a separate additional die rather than expanding the two-dimensional memory array. This vertical or separate-die approach allows yield enhancement through extra redundant storage without increasing the footprint or complexity of the core array structure.
Solution Approach 2:
The additional die serves multiple functions: it provides redundant storage for defective cell repair, acts as an address remapping intermediary, and can potentially provide other memory expansion or repair functions. This multi-functionality justifies the added complexity by delivering multiple benefits from a single structural addition.
Data Source
AI summary
A memory package may include multiple memory devices and an additional die in some examples. The memory package may be included on a memory module. The memory module may include multiple memory packages. The additional die may include components that reduce or eliminate a number of components on the memory module. In some embodiments, the additional die includes redundant storage for storing data associated with defective memory cells in the memory arrays on the multiple memory devices. The redundant storage can supplement redundant memory on the multiple memory devices or replace the redundant memory on the multiple memory devices.