Memory Package Pad Layout for Cross-Channel Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current memory packages face design limitations due to the need for shielding pads, which increase chip size and limit the flexibility of package development, especially in efficiently arranging buffer chips and memory chips.
Innovation Solution
A nonvolatile memory package with a cross-channel shielding structure, where input/output pads are alternately arranged for each channel, allowing for uniform bonding wire environments and reducing the need for shielding pads, enabling more compact and flexible package designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If shielding pads are used to prevent cross-talk between channels, then data reliability is improved, but chip size increases and package flexibility is reduced
Solution Approach 1:
The patent transitions from a conventional planar arrangement of input/output pads to a three-dimensional stacked configuration. Multiple layers of pads are arranged vertically, allowing channels to be separated in the Z-direction rather than requiring lateral shielding pads. This dimensional change enables cross-channel shielding without increasing the lateral chip footprint, resolving the contradiction between reliability and chip size.
Solution Approach 2:
The patent divides the input/output pads into multiple distinct layers, with each layer dedicated to specific channels. First input/output pads connect to first nonvolatile memory devices through a first bonding channel, while second input/output pads connect to second nonvolatile memory devices through a second bonding channel. This segmentation allows independent routing and shielding of each channel without requiring additional shielding pads, thus improving data reliability while maintaining compact chip size.
2Reliability
If shielding pads are used to minimize cross-talk between channels, then signal integrity is improved, but the degree of freedom of package development is reduced
Solution Approach 1:
By moving the shielding function to the vertical dimension through multi-layer pad stacking, the patent frees up the lateral dimension for flexible package configurations. The alternating arrangement of first and second input/output pads in different layers enables cross-channel shielding while allowing various bonding channel routing options and package substrate layouts, thereby maintaining adaptability and versatility in package development.
Solution Approach 2:
The multi-layer input/output pad structure serves multiple functions simultaneously: it provides cross-channel shielding for signal integrity, enables independent channel routing through different bonding channels, and maintains flexibility for various package configurations. This universal structure eliminates the need for dedicated shielding pads while supporting diverse package development requirements.
3Reliability
If input/output pads are alternately arranged for cross-channel shielding, then cross-talk between channels is minimized, but device complexity increases
Solution Approach 1:
The patent segments the input/output pads into first and second groups arranged in different layers, with each group dedicated to specific channels. This segmentation simplifies the routing logic for each channel while achieving cross-channel shielding through the vertical separation. The alternating arrangement in different layers creates natural shielding without requiring complex lateral routing patterns.
Data Source
AI summary
A nonvolatile memory package includes first nonvolatile memory devices configured to be stacked, second nonvolatile memory devices configured to be stacked, and an interface chip connected to an external device through a bonding channel, connected to one of the first nonvolatile memory devices through a first bonding channel, and connected to one of the second nonvolatile memory devices through a second bonding channel, wherein the interface chip includes input/output pads connected to the bonding channel, first input/output pads connected to the first bonding channel, and second input/output pads connected to the second bonding channel, and wherein, for cross-channel shielding, the first input/output pads and the second input/output pads are alternately arranged for each channel.