Memory Device Partition-Wall Structure for Plug Opening Control
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Solution Overview
Problem
The shrinking size of memory elements leads to challenges in manufacturing due to increased spacing difficulties and excessive expansion of conductive plug openings, resulting in abnormal bridging between adjacent conductive plugs.
Innovation Solution
The introduction of dummy partition walls and dummy bit line structures limits the expansion of conductive plug openings during the cleaning process by providing structural support, preventing abnormal bridging between adjacent conductive plugs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the size of memory elements is shrunk to achieve high integration, then the compactness and integration level are improved, but the spacing between elements becomes smaller leading to manufacturing difficulties and conductive plug opening expansion
Solution Approach 1:
The patent introduces dummy partition walls as intermediary structures positioned adjacent to actual partition walls. These dummy structures serve as mediators that limit the lateral expansion of conductive plug openings during cleaning processes, thereby preventing dimensional control issues while maintaining the shrunk memory element size for high integration.
Solution Approach 2:
The dummy partition walls are formed in advance before the conductive plug openings are etched. This preliminary action establishes the boundary constraints that prevent excessive expansion of the openings during subsequent cleaning steps, ensuring manufacturing precision is maintained throughout the fabrication process.
2Productivity
If the spacing between elements is reduced to increase integration, then the device compactness is improved, but the conductive plug openings expand excessively during cleaning causing abnormal bridging
Solution Approach 1:
Dummy partition walls are introduced as intermediary structures that physically limit the expansion of conductive plug openings during cleaning processes. This prevents abnormal bridging between adjacent conductive plugs, thereby maintaining connection reliability while enabling higher integration levels through reduced element spacing.
Solution Approach 2:
The dummy partition walls are formed preliminarily before conductive plug opening etching to establish boundary constraints. This preliminary structural support ensures that even with reduced spacing for higher integration, the conductive plugs maintain proper dimensional control and connection reliability throughout the fabrication process.
3Manufacturing precision
If dummy partition walls are introduced to limit conductive plug opening expansion, then the manufacturing precision is improved, but the device structure becomes more complex
Solution Approach 1:
The partition wall structure is segmented into two types: actual partition walls that define memory cell boundaries and dummy partition walls that provide dimensional control during fabrication. This segmentation allows the dummy structures to be added as separate, simple elements that enhance manufacturing precision without significantly complicating the overall device architecture.
Solution Approach 2:
The dummy partition walls function as temporary, disposable structures that serve their purpose during the fabrication process by limiting conductive plug opening expansion. After serving their function, they can be removed or rendered non-functional, having provided the necessary manufacturing precision without creating permanent structural complexity.
Data Source
AI summary
A memory device includes a substrate, word line structures, bit line structures, dummy bit line structures, partition walls, and conductive plugs. The bit line structures are disposed above the substrate and extend from the array region to a transition region in the substrate. The dummy bit line structures are disposed in the transition region in the substrate, adjacent to the bit line structures, and extending along the second direction. The partition walls are disposed above the bit line structures and the dummy bit line structures, extending along the first direction. The conductive plugs are located in the transition region in the substrate. Each of the conductive plugs is located between two adjacent ones of the dummy bit line structures, and extends through the partition walls, and is electrically connected to one of the word line structures.