Multi-Die Memory Package Power Management via Shared Conductive Path

Solution Overview

Problem

Conventional memory device packages with multiple conductive pads for inter-device communication increase area and cost, and fail to efficiently manage peak power consumption during operations like read, write, and erase.

Innovation Solution

A multi-die memory package where memory devices share power resources through a common conductive path, using a power management unit and driver circuitry to coordinate operations and manage peak current consumption by allowing only one or a subset of devices to perform high-power stages at a time, reducing the need for multiple pads and optimizing power usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple conductive pads are used for inter-device communication, then communication capability is improved, but package area and cost increase

Engineering Contradiction:

Improvecommunication capabilityVSAvoidpackage area

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The common conductive path is designed to serve multiple functions: it provides power supply to all memory devices and simultaneously enables communication between them. This multi-functional design eliminates the need for separate dedicated communication pads, reducing the overall package area while maintaining full communication capability among devices.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the power supply function and communication function into a single common conductive path. By combining these two functions that were previously handled by separate pads, the design reduces the number of required pads and minimizes package area without compromising either power delivery or inter-device communication.

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If multiple conductive pads are used for inter-device communication, then communication capability is improved, but manufacturing cost increases

Engineering Contradiction:

Improvecommunication capabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The common conductive path is designed to serve multiple functions: it provides power supply to all memory devices and simultaneously enables communication between them. This multi-functional design eliminates the need for separate dedicated communication pads, reducing the overall package area while maintaining full communication capability among devices.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the power supply function and communication function into a single common conductive path. By combining these two functions that were previously handled by separate pads, the design reduces the number of required pads and minimizes package area without compromising either power delivery or inter-device communication.

Inventive Principle:

Principle #5Merging (Combining)

3Productivity

If all memory devices perform high-power operations simultaneously, then operational speed is improved, but peak power consumption increases

Engineering Contradiction:

Improveoperational speedVSAvoidpeak power consumption

Core Design Contradiction:

ProductivityVSPower

Solution Approach 1:

The power management unit implements periodic arbitration and scheduling of high-power operations across multiple memory devices. Instead of allowing all devices to operate at peak power simultaneously, the system cycles through devices in controlled time intervals, ensuring that high-power operations are distributed periodically. This maintains overall productivity while preventing peak power consumption from exceeding the power supply capacity.

Inventive Principle:

Principle #19Periodic action

Solution Approach 2:

The system dynamically adjusts the operational state of each memory device based on real-time power consumption conditions. The power management unit monitors and controls which devices can perform high-power operations at any given moment, transitioning devices between active and standby states as needed. This dynamic control enables the system to maintain high overall throughput while keeping instantaneous peak power within safe limits.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS10170167B2Single node power management for multiple memory devices

Publication Date: 2019.01.01 MICRON TECHNOLOGY INC

AI summary

Some embodiments include apparatuses and methods having a node to couple to a plurality of memory devices, memory cells, and a module to perform an operation on the memory cells, to cause at least one change in a level of a signal at the node in order to make a request to perform a particular stage of the operation such that the request is detectable by the memory devices, and to perform the particular stage of the operation after the request is acknowledged. Other embodiments are described.