Memory Device Temperature Compensation Circuitry

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Solution Overview

Problem

Memory devices using semiconductive materials for data storage face performance issues due to temperature variations, as existing technologies lack effective temperature compensation methods to adjust operations accordingly.

Innovation Solution

Incorporating temperature circuitry within memory systems that includes temperature sensor circuitry to sense ambient temperature and conversion circuitry to provide temperature information, allowing for temperature compensation by adjusting parameters such as range and resolution, thereby optimizing data storage operations across varying temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If temperature compensation methods are implemented in memory systems, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improvememory operation stabilityVSAvoidcircuit structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The memory system performs self-diagnosis of temperature conditions and self-adjustment of operational parameters. The controller monitors temperature sensor outputs and automatically modifies read/write voltages and timing parameters without external intervention, enabling the system to compensate for temperature variations autonomously and maintain reliable operation across different thermal environments

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The system incorporates temperature sensors that continuously monitor the memory device temperature and feed this information back to the controller. The controller uses this feedback to dynamically adjust operational parameters such as read/write voltages, pulse widths, and timing margins, creating a closed-loop control system that maintains optimal performance despite temperature fluctuations

Inventive Principle:

Principle #23Feedback

2Adaptability or versatility

If temperature sensor circuitry and conversion circuitry are added, then adaptability is improved, but device complexity increases

Engineering Contradiction:

Improvetemperature range coverageVSAvoidcircuit components

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The temperature circuitry is designed to serve multiple functions: the temperature sensor provides both diagnostic information and control feedback, the conversion circuitry handles multiple temperature ranges through programmable thresholds, and the controller integrates temperature compensation with existing error correction and timing control functions. This multi-functionality reduces the need for separate dedicated circuits for each temperature management task

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS9576618B2Memory devices, memory device operational methods, and memory device implementation methods

Publication Date: 2017.02.21 MICRON TECHNOLOGY INC

AI summary

Memory devices, memory device operational methods, and memory device implementation methods are described. According to one arrangement, a memory device includes memory circuitry configured to store data in a plurality of different data states, temperature sensor circuitry configured to sense a temperature of the memory device and to generate an initial temperature output which is indicative of the temperature of the memory device, and conversion circuitry coupled with the temperature sensor circuitry and configured to convert the initial temperature output into a converted temperature output which is indicative of the temperature of the memory device at a selected one of a plurality of possible different temperature resolutions, and wherein the converted temperature output is utilized by the memory circuitry to implement at least one operation with respect to storage of the data.