Semiconductor Memory Word Line Voltage Control for Fast Charging

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Semiconductor memory devices face challenges in achieving high-speed operations due to increased wiring resistance and parasitic capacitance resulting from reduced Z-direction widths of conductive layers, which can lead to longer charging times and potential write errors.

Innovation Solution

The semiconductor memory device employs a specific voltage control strategy during the write operation, where the voltage of the selected word line is initially increased to a value larger than the program voltage plus a delta voltage, then decreased to the program voltage, and maintained at this level to ensure efficient charge storage and prevent write errors, while adjusting the delta voltage and loop number to optimize charging speed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the Z-direction width of conductive layers is reduced to increase integration density, then device integration is improved, but wiring resistance and parasitic capacitance increase leading to longer charging times

Engineering Contradiction:
Improveintegration densityVSAvoidcharging time
Core Design Contradiction:
Quantity of substanceVSLoss of time

Solution Approach 1:

The patent applies preliminary action by pre-charging the selected word line to a voltage higher than the standard program voltage before actual programming begins. This advance preparation ensures that when programming operations start, the word line is already at the required voltage level, eliminating delays during the programming process and compensating for the increased RC time constants caused by reduced conductive layer widths.

Inventive Principle:
Principle #10Preliminary action

2Quantity of substance

If the Z-direction width of conductive layers is reduced to increase integration density, then device integration is improved, but wiring resistance increases leading to potential write errors

Engineering Contradiction:
Improveintegration densityVSAvoidwrite accuracy
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies preliminary anti-action by pre-charging the selected word line to a voltage higher than the standard program voltage before programming operations begin. This advance voltage preparation counteracts the voltage drops that would occur during programming due to increased wiring resistance in the reduced Z-direction width structure, preventing write errors and ensuring reliable programming operations.

Inventive Principle:
Principle #9Preliminary anti-action

3Speed

If the voltage of the selected word line is increased to a value larger than the program voltage, then charging speed is improved, but voltage control complexity increases

Engineering Contradiction:
Improvecharging speedVSAvoidvoltage control complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent applies dynamics by implementing a two-stage voltage control strategy: first charging the selected word line to a higher voltage than the standard program voltage to accelerate charging speed, then reducing it to the standard program voltage level for the actual programming operation. This dynamic voltage adjustment optimizes both charging speed and programming accuracy while managing voltage control complexity through a structured approach.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS10937502B2Semiconductor memory device in which a conductive line connected to a word line selected for programming is charged to a voltage larger than the program voltage
Publication Date: 2021.03.02 KIOXIA CORP
  • US10937502B2 patent drawing
  • US10937502B2 patent drawing
  • US10937502B2 patent drawing

AI summary

A semiconductor memory device includes a first memory transistor, a first wiring connected to a gate electrode of the first memory transistor, a connection transistor connected to the first wiring, and a second wiring connected to the connection transistor. In a first write operation for the first memory transistor, during a first time period, a voltage of the first wiring increases to a first voltage and a voltage of the second wiring increases to a second voltage larger than the first voltage, and during a second time period directly after the first time period and directly after the connection transistor is turned ON, the voltage of the first wiring increases to a third voltage larger than the first voltage and smaller than the second voltage, and the voltage of the second wiring decreases to a fourth voltage larger than the first voltage and smaller than the second voltage.