Memory Cell Word Line Layout for Stable Gate Potential
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Solution Overview
Problem
The instability in writing or reading operations in semiconductor memory due to non-negligible power consumption and voltage variations caused by the length of word lines, as well as signal transmission abnormalities resulting from manufacturing defects in gate electrode lines, necessitates an optimization of the layout design of word lines.
Innovation Solution
The implementation of a memory fabrication method where conductive lines are directly connected to gate electrode lines, overlapping them to ensure equal electric potential and reduce resistance, thereby minimizing voltage differences and preventing signal abnormalities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the length of word lines is increased to cover more data storage cells, then the coverage area is improved, but power consumption increases and voltage stability deteriorates
Solution Approach 1:
The patent divides the gate electrode lines into multiple separate lines, each serving a specific data storage cell. Instead of using a single long word line to cover multiple cells, the invention segments the gate control into individual gate electrode lines (e.g., first gate electrode line, second gate electrode line) that can be independently controlled and connected to different conductive lines, thereby reducing the power consumption and voltage drop associated with long continuous conductors.
2Adaptability or versatility
If multiple layers are disposed between gate and word line, then the layout flexibility is improved, but electric potential consistency deteriorates
Solution Approach 1:
The patent implements equipotentiality by directly connecting gate electrode lines to conductive lines with minimal intervening layers. The first gate electrode line is connected to a first conductive line, and the second gate electrode line is connected to a second conductive line, ensuring that gates at different physical locations maintain consistent electric potential despite the multi-layer structure. This direct connection approach minimizes potential differences caused by multiple interposed layers.
3Adaptability or versatility
If gate electrode lines are made longer to reach more cells, then the connectivity is improved, but susceptibility to manufacturing defects increases
Solution Approach 1:
The patent segments the gate control architecture into multiple independent gate electrode lines rather than using fewer, longer lines. Each gate electrode line is connected to specific conductive lines (first conductive line, second conductive line, etc.), creating shorter, more localized connection paths. This segmentation reduces the likelihood and impact of manufacturing defects on overall signal transmission reliability.
4Reliability
If conductive lines are added to connect gate electrode lines, then the electric potential consistency is improved, but device complexity increases
Solution Approach 1:
The patent applies universality by using conductive lines that serve dual functions: they act as word lines for selecting data storage cells and simultaneously serve as connection paths to maintain electric potential consistency across multiple gate electrode lines. The first conductive line, second conductive line, and subsequent lines are integrated into the memory array structure, performing both control and potential reference functions, thereby reducing the need for additional dedicated potential reference lines.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of semiconductor memory by reducing power consumption and stabilizing voltage across data storage cells, improving the consistency of writing and reading operations while avoiding signal transmission issues.
Implementation Method 1
each of the plurality of conductive lines at least partially overlaps the two gate electrode lines of the plurality of gate electrode lines
Data Source
AI summary
The invention discloses a memory fabrication method. The memory fabrication method includes forming a plurality of gate electrode lines to respectively form a plurality of gates of a plurality of data storage cells, and forming a plurality of conductive lines. The plurality of data storage cells are arranged in an array. Each of the plurality of conductive lines is coupled to two of the plurality of gate electrode lines. Each of the plurality of conductive lines at least partially overlaps the two gate electrode lines of the plurality of gate electrode lines.


