MEMS Adjustable Spring Thermal Expansion Control

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Solution Overview

Problem

Microelectromechanical system (MEMS) sensors experience unwanted deformation and reduced accuracy due to thermal expansion during heating, which can lead to fractures and reliability issues.

Innovation Solution

A MEMS apparatus with an adjustable spring design, featuring a central portion, peripheral portion, and springs with varying thermal expansion coefficients, where the outward extension section has a greater thermal expansion coefficient than the peripheral and central sections, minimizing the thermal expansion that pushes the central portion and preventing excessive deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the MEMS sensor is heated to operating temperature, then the sensing accuracy is improved, but the sensor experiences thermal expansion causing deformation and reduced reliability

Engineering Contradiction:
Improvesensing accuracyVSAvoidsensor reliability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent applies thermal expansion principle by designing the spring structure with different thermal expansion coefficients for different sections. The outward extension section has a greater thermal expansion coefficient than the peripheral and central sections, allowing the spring to expand outward rather than pushing the central portion during heating, thus preventing deformation while maintaining operational temperature

Inventive Principle:
Principle #37Thermal expansion

2Measurement precision

If the MEMS sensor is heated to operating temperature, then the sensing accuracy is improved, but the sensor experiences unwanted deformation at the sensing area

Engineering Contradiction:
Improvesensing accuracyVSAvoidsensing area deformation
Core Design Contradiction:
Measurement precisionVSShape

Solution Approach 1:

The spring is designed with differential thermal expansion coefficients where the outward extension section expands more than other sections when heated. This differential expansion directs the thermal movement outward away from the central portion and sensing area, preventing unwanted deformation while allowing the sensor to operate at elevated temperatures for accurate sensing

Inventive Principle:
Principle #37Thermal expansion

3Strength

If the spring pushes the central portion during thermal expansion, then the spring provides structural support, but the central portion experiences excessive deformation

Engineering Contradiction:
Improvestructural supportVSAvoidcentral portion deformation
Core Design Contradiction:
StrengthVSShape

Solution Approach 1:

The spring structure utilizes differential thermal expansion where the outward extension section has a greater thermal expansion coefficient than the central and peripheral sections. During heating, this causes the spring to expand outward rather than pushing the central portion, maintaining structural support function while preventing excessive deformation of the central portion

Inventive Principle:
Principle #37Thermal expansion

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces thermal stress and deformation, enhancing the reliability and measurement accuracy of the MEMS apparatus by controlling thermal expansion.

Implementation Method 1

a technique that can heat the MEMS sensor up to a specific operating temperature is used

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

An amount of thermal expansion per unit temperature change of the outward extension section is greater than an amount of thermal expansion per unit temperature change of the peripheral section or greater than an amount of thermal expansion per unit temperature change of the central section

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10703625B1Microelectromechanical system (MEMS) apparatus with adjustable spring
Publication Date: 2020.07.07 IND TECH RES INST
  • US10703625B1 patent drawing
  • US10703625B1 patent drawing
  • US10703625B1 patent drawing

AI summary

A MEMS apparatus with adjustable spring includes a central portion, a peripheral portion and at least one spring. The peripheral portion surrounds the central portion and is spaced apart from the central portion. The spring includes a peripheral section, an outward extension section and a central section. The peripheral section is connected to the outward extension section. An amount of thermal expansion per unit temperature change of the outward extension section is greater than that of the peripheral section or greater than that of the central section.