Piezoelectric/Electrostrictive Devices TRIZ Cases
- Optical Scanning Device Asymmetric Frame Connection
Opposed movable frame connections suppress ringing and maintain voltage linearity without multiple filters.
- Piezoelectric Actuator Contact Plates Embossed Edges
Embossed stamped edges introduce compressive stresses to piezoelectric actuator contact plates, preventing fractures under high vibrational stress.
- MEMS Adjustable Spring Thermal Expansion Control
Differential thermal expansion in MEMS springs prevents central portion deformation and maintains sensing accuracy during heating.
- MEMS Autofocus Actuator Piezoelectric Motion Stops
Piezoelectric motion stops restrict out-of-plane movement in MEMS autofocus actuators.
- Enclosed Cavity Structures for MEMS Mechanical Isolation
A cap seals a substrate cavity to enclose MEMS components and provide mechanical isolation.
- MEMS Differential Capacitor Asymmetric Extension Walls
Asymmetric extension walls balance parasitic capacitance in MEMS differential capacitors, eliminating deviation errors that degrade measurement sensitivity.
- Light Deflection Device Counter Swing Member Vibration Suppression
A light deflection device uses a counter swing member to offset exciting forces acting on the fixed unit.
- MEMS Mirror Axial Deflection Limiting
End stop arms limit axial deflection to prevent plastic deformation during impacts, maintaining high dynamics.
- Piezoelectric Pressing Sensor with Oblique Electrodes
A pressing sensor uses a chiral polymer piezoelectric film with detection electrodes arranged obliquely to the drawing direction.
- Micromirror Diaphragm Mass Reduction for Vibration Robustness
Composite silicon oxide and nitride layers maintain structural stability while reducing micromirror mass to resolve vibration robustness trade-offs.
- MEMS Scanning Mirror BoPET Hinge Shock Resistance
A MEMS scanning mirror uses biaxially-oriented polyethylene terephthalate hinges to rotationally couple frames and plates.
- MEMS Capacitance Gap Measurement via Fringing Field Elimination
Processing circuitry removes fringing field effects from compared signals to eliminate fabrication deviations and ensure accurate measurement precision.
- MEMS Mirror Drive Coil Diffusion Barrier
A tungsten covering layer prevents copper diffusion into insulating layers, eliminating short-circuiting in MEMS mirror drives.
- Piezoelectric Sensor Stack Structure for Optical Scanning S/N Ratio
Segmenting piezoelectric layers optimizes drive efficiency and sensor output to resolve wiring complexity trade-offs.
- Out-of-plane Bimorph MEMS Micromirrors for Large Angle Beamsteering
Out-of-plane bimorph designs resolve the contradiction between tip/tilt angle limits and device complexity by enabling scalable high fill-factor arrays.
- MEMS Central Anchor Stress Isolation
A MEMS device with a central anchor isolates the proof mass from substrate stress, reducing thermal noise and improving signal accuracy.