MEMS Scanning Mirror BoPET Hinge Shock Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing MEMS scanning mirrors fabricated using silicon as the hinge material are susceptible to damage from shock or impacts, limiting their application in environments such as underwater optical and acoustic imaging, handheld biomedicine imaging, and autonomous vehicle systems.
Innovation Solution
A method for batch fabrication of MEMS scanning mirrors using biaxially-oriented polyethylene terephthalate (BoPET) and elastomer hinges, which provides higher resistance to impact and shock damage compared to silicon hinges, enabling wider application in various environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If silicon hinges are used in MEMS scanning mirrors, then manufacturing precision and alignment accuracy are improved, but reliability under shock and impact conditions deteriorates
Solution Approach 1:
The patent employs composite hinge structures combining silicon with other materials (such as silicon nitride or polysilicon) to achieve both high manufacturing precision and improved shock resistance. The composite structure allows the hinge to maintain dimensional stability and alignment accuracy while the additional materials provide enhanced toughness and impact resistance, resolving the contradiction between precision and reliability under shock conditions.
2Volume of moving object
If smaller device sizes are achieved, then adaptability to demanding environments is improved, but manufacturing precision may deteriorate
Solution Approach 1:
The patent segments the MEMS scanning mirror into modular components (mirror plate, hinge structures, support frames) that can be independently fabricated and then precisely assembled. This segmentation allows each component to be optimized for its specific function while maintaining overall compactness, and the modular assembly process preserves alignment accuracy even in miniaturized devices.
Solution Approach 2:
The patent utilizes thin film hinge structures and flexible support elements that enable compact device design while maintaining structural integrity. These thin film components provide the necessary flexibility for rotation and movement in small devices while their controlled thickness and material properties ensure precise alignment is maintained during operation.
Data Source
AI summary
Methods are disclosed for manufacturing a Micro-ElectroMechanical Systems (MEMS) scanning mirror. In an embodiment, one method includes depositing a hinge material on a substrate and removing first and second portions of the substrate to form an outer frame, an inner frame, and a mirror plate in the substrate. First and second portions of the hinge material rotationally couple the outer frame to the inner frame and the inner frame to the mirror plate for rotation about first and second orthogonal axes of rotation. In another embodiment, a third portion of the substrate rotationally couples the inner frame to the mirror plate. In still another embodiment, an elastomer material is configured as a bending hinge that rotationally couples the outer frame to the inner frame.