MEMS Device Barrier Region Inhibits Epoxy Flow
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Solution Overview
Problem
In MEMS transducer packaging, the flip-chip arrangement can lead to bonding solution flow towards critical regions, potentially undermining the transducer's performance due to the orientation of the backplate and membrane layers, which may result in contamination and performance degradation.
Innovation Solution
A barrier region with surface discontinuities, such as dimples or recesses, is created on the top surface of the MEMS device laterally outside the cavity opening to inhibit the flow of bonding solutions, defining wettable and non-wettable areas and preventing the bonding solution from reaching sensitive transducer components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a flip-chip arrangement is used for MEMS transducer packaging, then bonding efficiency and assembly speed are improved, but bonding solution may flow towards critical regions causing contamination and performance degradation
Solution Approach 1:
A barrier region is introduced as an intermediary structure between the bonding solution application area and the critical transducer components. This barrier region, formed by discontinuities in the top surface layer, acts as a mediator that allows the bonding process to proceed efficiently while preventing the bonding solution from reaching sensitive areas, thus resolving the contradiction between bonding efficiency and contamination prevention
Solution Approach 2:
The top surface of the MEMS device is given non-uniform properties through the barrier region with surface discontinuities. This local variation in surface quality creates areas with different wettability characteristics, allowing the bonding solution to be contained in specific regions while protecting other areas, thereby enabling both efficient bonding and contamination prevention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The barrier region effectively isolates vulnerable transducer components from bonding solutions, ensuring the acoustic and mechanical integrity of the MEMS transducer by preventing contamination and maintaining performance, while allowing for an acoustic seal and efficient heat management.
Implementation Method 1
A barrier region with surface discontinuities, such as dimples or recesses, is created on the top surface of the MEMS device laterally outside the cavity opening to inhibit the flow of bonding solutions
Implementation Method 2
defining wettable and non-wettable areas and preventing the bonding solution from reaching sensitive transducer components
Data Source
AI summary
The present disclosure describes techniques for altering the epoxy wettability of a surface of a MEMS device. Particularly applicable to flip-chip bonding arrangements in which a top surface of a MEMS device is adhered to a package substrate. A barrier region is provided on a top surface of the MEMs device, laterally outside a region which forms, or overlies, the backplate and/or the cavity in the transducer substrate. The barrier region comprises a plurality of discontinuities, e.g. dimples, which inhibit the flow of epoxy.