MEMS Metal Film Bridge Support Structure Against Collapse and Warping
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Solution Overview
Problem
Existing MEMS devices face challenges in preventing the metal film bridge from collapsing or warping during the fabrication process due to residual stress and stress gradients, leading to potential failure of the device.
Innovation Solution
The proposed MEMS device incorporates a support structure with a Young's modulus greater than that of the metal film bridge, providing strong support and enhancing the bending stiffness of the metal film bridge to prevent collapse and warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal film bridge is used in MEMS device fabrication, then the device can achieve low insertion loss and low electrical power consumption, but the metal film bridge is prone to collapsing or warping due to residual stress and stress gradients
Solution Approach 1:
The support structure is pre-formed on the substrate before the metal film bridge is deposited. This preliminary action provides a stable foundation that prevents the metal film bridge from collapsing or warping during subsequent fabrication processes, addressing the stability issue while maintaining the bridge's functional properties
Solution Approach 2:
The invention combines the metal film bridge with a support structure made of different material properties (higher Young's modulus). This composite structure leverages the electrical properties of the metal film while using the support structure's mechanical properties to prevent collapse and warping, resolving the contradiction between reliability and stability
2Volume of moving object
If the metal film bridge is made thinner to reduce device size, then miniaturization is achieved, but the bridge becomes more susceptible to deformation and collapse
Solution Approach 1:
The support structure is prepared in advance on the substrate, creating a pre-stabilized platform. This allows the metal film bridge to be deposited as a thin layer without collapsing, enabling miniaturization while maintaining structural strength through the underlying support
Solution Approach 2:
The support structure provides localized mechanical reinforcement specifically where the thin metal film bridge needs it most, without increasing the overall device volume. This local quality enhancement allows the bridge to be thinner while maintaining strength against deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces the deformation of the metal film bridge by up to 80%, thereby minimizing the risk of collapse and ensuring the stability and functionality of the MEMS device.
Implementation Method 1
a support structure, fixedly arranged with the metal film bridge, where a Young's modulus of the support structure is greater than a Young's modulus of the metal film bridge
Data Source
AI summary
The embodiments of the present disclosure provide an MEMS device and an electronic device. The MEMS device includes: a base substrate; an electrode structure, which is located on the base substrate and includes a first ground electrode, a signal transmission electrode and a second ground electrode, which are sequentially arranged on the base substrate at intervals; a metal film bridge, which spans above the signal transmission electrode and forms a cavity with the signal transmission electrode, where two ends of the metal film bridge are respectively electrically connected to the first ground electrode and the second ground electrode; and a support structure, which is fixedly arranged with the metal film bridge, wherein the Young's modulus of the support structure is greater than the Young's modulus of the metal film bridge.