MEMS Coupler Design for Anchor Composition and Structural Integrity
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Solution Overview
Problem
Current methods for fabricating MEMS resonators, such as the total damascene and anchor-then-beam approaches, face limitations in anchor composition and structural integrity, where the anchor's composition is often limited to matching the resonating member, and the structural integrity is dependent on a single anchor/resonating member interface.
Innovation Solution
A MEMS coupler that extends through a portion of the member to connect it with the substrate, allowing for enhanced mechanical strength and optimized electrical contact by using a conductive material for the coupler that can be either the same or more conductive than the member, thereby improving the structural integrity and electrical connectivity without altering the member's material properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a total damascene approach is used to fabricate MEMS resonator, then the anchor and resonating member are formed simultaneously, but the composition of the anchor is limited to being the same as the composition of the resonating member
Solution Approach 1:
The fabrication process is divided into separate steps: first forming the resonating member, then forming the anchor in a subsequent step. This segmentation allows independent material selection for each component, enabling the anchor to have different composition than the resonating member while maintaining manufacturing feasibility.
Solution Approach 2:
The resonating member is formed first as a preliminary step before forming the anchor. This preliminary action enables the anchor material to be selected and deposited after the resonating member geometry is established, providing flexibility in anchor composition without affecting the resonating member fabrication.
2Ease of manufacture
If an anchor-then-beam approach is used to fabricate MEMS resonator, then the anchor is formed first, but the structural integrity is dependent upon a single anchor/resonating member interface
Solution Approach 1:
The coupler is merged with both the anchor and the resonating member, creating a unified structural connection. The coupler extends through the resonating member to connect with the anchor, forming an integrated three-component assembly that distributes mechanical stress across multiple interfaces rather than relying on a single interface.
Solution Approach 2:
The coupler acts as an intermediary component between the anchor and the resonating member. It provides a mechanical bridge that enhances the connection, distributing loads and improving structural integrity by creating additional bonding interfaces rather than relying solely on the direct anchor-resonating member interface.
3Reliability
If the coupler is made of conductive material, then electrical contact is optimized, but the coupler material must be different from or more conductive than the member
Solution Approach 1:
The coupler is assigned a specific local quality of high electrical conductivity, which may differ from the resonating member material. This localized material optimization allows the coupler to be specifically tailored for electrical contact performance without requiring the entire resonating structure to be made of conductive material, maintaining design flexibility.
Data Source
AI summary
A MEMS coupler and a method to form a MEMS structure having such a coupler are described. In an embodiment, a MEMS structure comprises a member and a substrate. A coupler extends through a portion of the member and connects the member with the substrate. The member is comprised of a first material and the coupler is comprised of a second material. In one embodiment, the first and second materials are substantially the same. In one embodiment, the second material is conductive and is different than the first material. In another embodiment, a method for fabricating a MEMS structure comprises first forming a member above a substrate. A coupler comprised of a conductive material is then formed to connect the member with the substrate.