MEMS Decoupling Structure for Thermal Stress Compensation
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Solution Overview
Problem
The assembly of MEMS and NEMS components with their packaging is prone to mechanical and thermal stresses due to differences in thermal expansion coefficients between the component materials and the packaging materials, leading to increased size requirements and potential operational issues.
Innovation Solution
A suspended and mobile decoupling structure is integrated within the component itself, allowing for mechanical and thermal decoupling between the component and the packaging, which absorbs or compensates for stresses without requiring additional space or intermediate elements, thus maintaining the component's operational integrity and reducing size constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an intermediate frame is added between the component and the box to provide mechanical and thermal decoupling, then the stress compensation is improved, but the space requirement in the z-direction increases
Solution Approach 1:
The decoupling structure is merged with the component substrate itself rather than being a separate intermediate frame. The substrate is structured to include suspended beams that directly provide mechanical and thermal decoupling functionality, eliminating the need for additional space-consuming intermediate structures.
Solution Approach 2:
The decoupling structure is arranged in the thickness direction (z-direction) of the component substrate itself, utilizing the existing vertical dimension of the component rather than adding another layer of intermediate structures. This integrates the decoupling function within the component's own dimensional envelope.
2Reliability
If additional intermediate elements are introduced to provide mechanical and thermal decoupling, then the stress absorption is improved, but the device complexity increases
Solution Approach 1:
The decoupling structure is merged with the component substrate itself rather than being a separate intermediate frame. The substrate is structured to include suspended beams that directly provide mechanical and thermal decoupling functionality, eliminating the need for additional space-consuming intermediate structures.
Solution Approach 2:
The component substrate itself provides the decoupling functionality through its own structural design, without requiring external intermediate elements. The suspended beams are formed as part of the substrate, allowing the component to self-decouple from the packaging structure.
3Reliability
If the assembly is made more robust to handle thermal and mechanical stresses, then the reliability is improved, but the size of the assembly increases
Solution Approach 1:
The decoupling structure is merged with the component substrate itself rather than being a separate intermediate frame. The substrate is structured to include suspended beams that directly provide mechanical and thermal decoupling functionality, eliminating the need for additional space-consuming intermediate structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively mitigates thermal and mechanical stresses, maintaining the component's functionality while minimizing the overall size of the assembly, and simplifies electrical connections by separating them from the decoupling structure, reducing costs and ensuring reliable operation.
Implementation Method 1
the material of the case, for example a plastic material, a resin, or even a PCB (polychlorobiphenyl), generally has a coefficient of thermal expansion very different from that of the material of the component
Implementation Method 2
The assembly between the MEMS component and the package is often sensitive to mechanical and/or thermal stresses
Data Source
Figure 1~3
Figure 4~6
Figure 7A~7F
AI summary
Assembly between a MEMS and/or NEMS electromechanical component (20) and a casing (1), the electromechanical component (20) comprising at least one suspended and movable structure (26) which is provided with at least one fixing zone (26a), on which a region (3) for receiving the casing is fixed, the suspended structure being at least partially formed in a cover (29) for protecting the component or in a layer (25) which is different from the one in which the sensitive element of the component is formed.