Low Stress MEMS Package With Die Cap Isolation
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Solution Overview
Problem
Microelectromechanical systems (MEMS) devices, such as gyroscopes and accelerometers, are sensitive to external forces and environmental contaminants, and conventional packaging methods often induce excessive stresses that can damage these devices and degrade their performance.
Innovation Solution
A low stress integrated device package design that includes a package housing with a base, sidewall, and lid, a carrier, and a support structure attached to the die cap, which mechanically couples the die cap to the package housing, minimizing contact with die attach materials and encapsulants to reduce stress on sensitive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional packaging methods are used to protect MEMS devices, then the devices are enclosed and protected from environmental contaminants, but excessive stresses are induced that can damage the devices and degrade performance
Solution Approach 1:
A die cap is introduced as an intermediary component between the MEMS die and the package housing. The die cap is bonded to the die surface over the sensitive component, acting as a stress-isolating mediator that protects the sensitive MEMS components from stresses transmitted through the packaging structure while maintaining environmental protection
Solution Approach 2:
The die cap is selectively bonded to cover only the sensitive component area on the die surface. This localized bonding approach provides stress protection precisely where needed while minimizing the overall stress transmission path, allowing the package to protect the device without inducing excessive stresses on the sensitive regions
2Strength
If die attach materials are used to mount the die to the package housing, then the die is securely held in place, but stresses are transmitted to the sensitive components causing damage or performance degradation
Solution Approach 1:
The die cap serves as a stress-isolating intermediary between the die and the package housing. It is bonded to the die surface over the sensitive component, creating a localized bond that provides mechanical strength while preventing stress transmission to the sensitive MEMS structures beneath
Solution Approach 2:
The bonding structure is segmented into distinct regions: the die cap is bonded only to the sensitive component area, while the rest of the die surface remains unbonded. This segmentation allows localized mechanical support without creating continuous stress paths that would damage the sensitive components
3Stability of the object's composition
If the die is fully bonded to the package housing, then the device is securely packaged, but the sensitive components are exposed to external forces and stresses
Solution Approach 1:
The bonding is applied locally only to the die cap covering the sensitive component, rather than bonding the entire die surface to the package housing. This localized bonding provides structural stability at the critical location while leaving other areas stress-free and isolated from external forces
Solution Approach 2:
The die cap acts as a stress-isolating intermediary that is selectively bonded to the package housing. This intermediary structure provides the necessary structural stability and environmental protection while preventing direct stress transmission to the sensitive MEMS components through the bond interface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces stress on MEMS devices, as shown by improved performance over time with reduced sensor errors, protecting sensitive components from external forces and environmental factors.
Implementation Method 1
The integrated device die includes a die cap that is bonded to the first surface over the sensitive component
Implementation Method 2
a support structure that is attached to the die cap. The support structure mechanically couples the die cap and the package housing
Implementation Method 3
The carrier that is mounted to a portion of the package housing
Data Source
AI summary
An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.