MEMS Gas Detector Edge Reinforcement via Anode Bonding

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Solution Overview

Problem

The existing MEMS gas detector manufacturing process is weakened by recesses designed to accommodate air, leading to edge collapsing during cutting, resulting in reduced yield rates and increased costs, and requires repeated steps for multi-gas detection, prolonging production time and increasing costs.

Innovation Solution

A method involving a MEMS wafer with side block portions and bottom chambers, reinforced with a structure layer bonded via anode bonding, and using adhesive tape for cutting and assembly, enhancing strength and allowing simultaneous formation of multi-gas detection units in a single cutting process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a recess is designed to accommodate air in the MEMS device, then the heat source can be kept focused, but the strength of the overall device is reduced and edge collapsing occurs during cutting

Engineering Contradiction:

Improveheat source focusVSAvoiddevice strength

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The patent applies preliminary action by bonding a structure reinforcing layer to the MEMS wafer before the cutting process. This reinforcing layer pre-strengthens the device structure, particularly the edges that would otherwise collapse during cutting, while preserving the recess design for heat focus. The reinforcement is applied in advance to prevent rather than repair the weakness.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses composite materials by combining the MEMS wafer material with a structure reinforcing layer made of different material properties. This composite structure allows the device to maintain both the heat-focused recess design and sufficient mechanical strength for cutting, as the reinforcing layer compensates for the strength reduction caused by the recess.

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If multiple MEMS sensors are installed to sense multiple types of gases, then multi-gas detection capability is achieved, but production costs and production time increase due to repeated steps

Engineering Contradiction:

Improvemulti-gas detection capabilityVSAvoidproduction time

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent merges multiple gas detection functions into a single integrated MEMS device structure. Instead of installing separate MEMS sensors for different gases through repeated steps, the invention incorporates multiple gas sensing material layers within one MEMS wafer structure, allowing multi-gas detection to be achieved in a single manufacturing process.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent applies universality by designing a single MEMS device structure that can detect multiple types of gases simultaneously. The unified structure with multiple gas sensing materials makes the device multi-functional, eliminating the need for separate specialized sensors and reducing production complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If multiple MEMS sensors are installed to sense multiple types of gases, then multi-gas detection capability is achieved, but production costs increase due to repeated steps

Engineering Contradiction:

Improvemulti-gas detection capabilityVSAvoidproduction cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

4Productivity

If a cutting process is performed on the MEMS wafer, then individual units are formed, but edge collapsing occurs and residuals or cleaning liquid accumulate, lowering yield rate

Engineering Contradiction:

Improveunit formationVSAvoidedge integrity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by bonding a structure reinforcing layer to the MEMS wafer before the cutting process. This reinforcing layer pre-strengthens the device structure, particularly the edges that would otherwise collapse during cutting. The reinforcement is applied in advance to prevent rather than repair the weakness, ensuring clean cuts without edge collapsing or residual accumulation.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method strengthens the device, reduces edge collapsing, enhances yield rates, and decreases production costs by enabling the formation of multi-gas detection units in a single process, while avoiding adhesive-related issues and heat damage.

Implementation Method 1

a structure reinforcing layer is bonded with the MEMS wafer through anode bonding

Methodology Applied

Scientific EffectAnode bonding:

Data Source

PatentUS10294100B2Method for manufacturing gas detector by MEMS process

Publication Date: 2019.05.21 TAIWAN CARBON NANO TECHNOLOGY CORPORATION

AI summary

A method for manufacturing a gas detector by a micro-electrical-mechanical systems (MEMS) process. The method includes providing a MEMS wafer including a plurality of mutually adjacent units; forming a gas sensing material layer on the MEMS wafer; bonding a structure reinforcing layer and the MEMS wafer through anode bonding; providing an adhesive tape; performing a cutting process to form a gas detection unit; and adhering the gas detection unit on a substrate by the adhesive tape to form a gas detector. The structure reinforcing layer is capable of enhancing the strength of a device and preventing edge collapsing, and hence enhancing the overall yield rate and reducing costs.