MEMS Mass Interconnect for High-Frequency ATE Signal Integrity
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Solution Overview
Problem
Conventional automatic test equipment faces challenges in maintaining signal integrity at high frequencies due to physical separation between the unit under test and pin electronics, leading to signal degradation and limitations in testing speeds beyond 12 GHz.
Innovation Solution
A MEMS-based mass interconnect system with a universal mounting table and micro test-channels is introduced to minimize physical separation between the unit under test and pin electronics, using spring contacts and a resiliently deformable biasing member to maintain signal integrity up to 50 GHz.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional mass interconnect system mounting tables are used, then general purpose pin electronics can cover different test scenarios, but physical separation between unit under test and pin electronics causes signal integrity degradation at high frequencies
Solution Approach 1:
The mounting table is segmented into modular test interface modules, each handling specific test functions. This allows pin electronics to be positioned immediately adjacent to the unit under test while maintaining versatility through module selection and configuration.
Solution Approach 2:
The patent transitions from conventional planar mounting to a three-dimensional configuration where pin electronics are positioned vertically adjacent to the unit under test contacts. This dimensional change reduces transmission distance while preserving general purpose functionality through modular design.
2Reliability
If pin electronics are positioned adjacent to unit under test pins, then transmission line effects are reduced, but general purpose pin electronics become bulky and cannot be readily integrated
Solution Approach 1:
Pin electronics are divided into functional segments within modular test interface modules. Each module contains only the necessary pin electronics for specific test scenarios, reducing bulk while maintaining general purpose capability through module interchangeability.
Solution Approach 2:
Pin electronics are nested within compact modular test interface modules that integrate multiple functions in a space-efficient manner. This nesting allows adjacent positioning without excessive bulk, as functions are consolidated within each module.
3Reliability
If conventional mounting tables are used, then robust testing capability is maintained, but considerable power consumption and cooling requirements arise
Solution Approach 1:
The mounting table is divided into independent modular test interface modules, each consuming power only when actively used. This segmentation reduces overall power consumption compared to conventional mounting tables that require continuous power for cooling and operation across the entire surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MEMS-based interface module significantly reduces transmission line effects, allowing high-speed testing of electronic components up to 50 GHz with minimal signal loss and distortion, enhancing the performance of automatic test equipment.
Implementation Method 1
a resiliently deformable biasing member operable to move the conductive pad into electrical contact with the contact pin
Data Source
AI summary
An automatic test equipment (ATE) unit, which incorporates a mass interconnect system. The mass interconnect system is provided with a universal mounting table for use with receiver and test interface modules for electronically mounting and testing a variety of different types of electronic components or unit under test thereon. The mounting table test interface module incorporates MEMS based spring contacts to provide high-speed micro test-channels in order to establish signal connectivity between the components or unit under test and the tester, and which maintain the signal integrity up to 50 GHz without significant signal loss distortion.