MEMS Micro-Mirror Assembly Flexible PCB Integration
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Solution Overview
Problem
The integration of MEMS micro-mirror devices into projection systems is hindered by the fragility of wire bonds and electrical connectors, which can easily break during handling, making it difficult to achieve a stable and robust electrical connection.
Innovation Solution
A MEMS micro-mirror assembly is mounted on a flexible PCB board, where the MEMS die is mechanically connected using glue, and electrical connections are established through a combination of wire bonds and conductive glue, with multiple wire bonds providing increased mechanical stability and the flexible PCB board being reinforced in areas with conductive lines to prevent mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonds and electrical connectors are used to integrate MEMS micro-mirror devices into projection systems, then electrical connection is achieved, but the connection is fragile and prone to breakage during handling
Solution Approach 1:
The patent introduces a flexible PCB board as an intermediary component between the MEMS micro-mirror device and the projection system. This PCB board provides a robust mechanical support structure with integrated electrical traces that replace fragile wire bonds and connectors. The PCB board mechanically mounts the MEMS device while simultaneously providing stable electrical connections through its conductive pathways, thus resolving the contradiction between electrical connectivity and mechanical strength.
2Reliability
If multiple wire bonds are used to provide increased mechanical stability, then electrical connection stability improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the mechanical mounting function and the electrical connection function into a single integrated component - the flexible PCB board. Instead of using separate wire bonds and connectors that require multiple assembly steps, the PCB board combines structural support with integrated electrical traces, thereby reducing device complexity and manufacturing difficulty while maintaining reliable electrical connections.
3Ease of manufacture
If the MEMS die is mechanically connected using glue, then assembly ease improves, but mechanical strength and reliability may be compromised
Solution Approach 1:
The patent employs a composite mounting approach where the flexible PCB board itself acts as a composite structure providing both mechanical support and electrical connectivity. The PCB board's layered construction (combining flexible substrate with conductive traces) creates a robust mechanical connection that is stronger than glue alone, while the flexibility of the PCB material allows for ease of assembly and stress absorption during handling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a flexible PCB board and robust electrical connections enables easier and more stable integration of MEMS micro-mirror assemblies into projection systems, reducing the risk of wire bond breakage and enhancing mechanical stability, thus facilitating reliable operation.
Implementation Method 1
the flexible PCB board being reinforced in areas with conductive lines to prevent mechanical stress
Implementation Method 2
electrical connections are established through a combination of wire bonds and conductive glue
Data Source
Figure 1a
Figure 1b
Figure 1c
AI summary
A MEMS micro-mirror assembly (250, 300, 270, 400) comprising, a MEMS device (240) which comprises a MEMS die (241) and a magnet (231); a flexible PCB board (205) to which the MEMS device (240) is mechanically, and electrically, connected; wherein the flexible PCB board (205) further comprises a first extension portion (205b) which comprises a least one electrical contact (259a,b) which is useable to electrically connect the MEMS micro-mirro rassembly (250, 300, 270, 400) to another electrical component). There is further provided a projection system comprising such a MEMS micro-mirror assembly (250, 300, 270, 400).