Capacitive MEMS Microphone Impact Resisting Device
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Solution Overview
Problem
Conventional Electret Capacitor Microphones (ECMs) are rendered ineffective in high-temperature environments and require manual assembly, whereas capacitive MEMS microphones can withstand high temperatures but lack improved impact resistance and efficient manufacturing processes for smaller, lower-cost, and better-performance designs.
Innovation Solution
A capacitive MEMS microphone design featuring a substrate with a movable diaphragm, anchors, flexible beams, and an impact resisting device, along with a method involving dielectric and conductive layers, silicon etching, and wet etching to create a chamber and room structure for enhanced shock resistance and automatic assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional Electret Capacitor Microphone (ECM) is used, then manual assembly is required, but high-temperature environment causes electricity leakage and renders the microphone invalid
Solution Approach 1:
The patent replaces the electret capacitor structure with a capacitive MEMS structure that uses mechanical suspension and electrical connection through flexible beams and anchors, enabling both high-temperature resistance and automated SMT assembly
Solution Approach 2:
The patent changes the material and structural parameters by using a capacitive MEMS design with specific flexible beams and anchors that can withstand high temperatures while maintaining electrical connectivity, unlike conventional ECM structures
2Ease of manufacture
If capacitive MEMS microphone is used, then high-temperature resistance and automatic assembly are achieved, but impact resistance is insufficient
Solution Approach 1:
The patent incorporates an impact resisting device with buffers that are pre-positioned to absorb and cushion impact forces before they reach the movable diaphragm and sensitive components, protecting the structure from shock damage
Solution Approach 2:
The impact resisting device acts as an intermediary between the external environment and the sensitive internal components, absorbing impact forces through buffers and protecting the movable diaphragm and flexible beams from damage
3Volume of moving object
If microphone dimension is reduced, then smaller size is achieved, but manufacturing precision and quality consistency become more difficult
Solution Approach 1:
The patent designs the movable sensitive layer, flexible beams, and anchors as integrated multi-functional components that simultaneously provide mechanical support, electrical connection, and shock protection, enabling consistent manufacturing through standardized processes
Solution Approach 2:
The patent divides the microphone into distinct functional modules (substrate, movable sensitive layer, backplate, impact resisting device) that can be manufactured separately with precise control and then assembled, improving quality consistency in miniaturized designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances impact resistance and allows for automatic assembly, maintaining sensitivity and signal-noise ratio while reducing stress and ensuring consistent quality across batches, and minimizing the impact of packaging stress on microphone performance.
Implementation Method 1
capacitive micro-electro-mechanical system (MEMS) microphone
Implementation Method 2
a plurality of flexible beams each of which is employed to connect one of the anchors to the movable diaphragm
Implementation Method 3
an impact resisting device connecting to the movable diaphragm... a buffer extending within the room and connecting the bearing portion and the distal portion
Data Source
AI summary
The invention relates to a capacitive MEMS microphone and a method for manufacturing the same. The microphone includes: a substrate; a first dielectric supporting layer on the substrate; a movable sensitive layer formed on the first dielectric supporting layer and having a movable diaphragm extending within the air; a backplate disposed over the movable sensitive layer and spaced from the movable diaphragm; a chamber recessed from and extending through the substrate and the first dielectric supporting layer; and an impact resisting device connecting to the movable diaphragm. The impact resisting device is exposed downwardly and disposed above the chamber. The movable sensitive layer has a number of anchors formed around the movable diaphragm, a number of flexible beams each of which is employed to connect one of the anchors to the movable diaphragm, and a bonding portion connecting to the anchor.


