MEMS Microphone Package Stack Structure Eliminates Wire Bonding
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Solution Overview
Problem
Existing MEMS microphone packages are limited in size reduction due to the need for space reserved for wire-bonding, which hinders the development of slim, compact, and lightweight electronic devices.
Innovation Solution
The implementation of a stack structure in the MEMS microphone package, where the circuit device and sensor are electrically connected through through silicon via structures and underfill glue, eliminating the need for wire-bonding and allowing for a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wire-bonding is used for electrical connection, then electrical connectivity is achieved, but the package size cannot be effectively reduced
Solution Approach 1:
The patent extracts and eliminates the wire-bonding structure from the package design. By removing this external connection method and replacing it with integrated through-silicon-via connections, the space previously required for wire-bonding operations and associated clearance is freed up, directly reducing the overall package volume.
Solution Approach 2:
The patent merges the electrical connection function into the substrate structure itself through through-silicon-via technology. The circuit board and sensor are electrically connected via integrated vias within the substrate rather than through external wire-bonding, combining the mechanical support and electrical connection functions into a single integrated structure.
2Reliability
If space is reserved for wire-bonding, then electrical connection is ensured, but the amount of space in the package increases
Solution Approach 1:
The electrical connection function is merged into the substrate structure through through-silicon-via technology. The vias provide both mechanical support and electrical connectivity within the integrated substrate, eliminating the need for separate wire-bonding operations and the associated space requirements.
Solution Approach 2:
The patent transitions from a planar wire-bonding approach to a three-dimensional through-silicon-via approach. Electrical connections are established through the thickness of the substrate rather than along the surface, utilizing the vertical dimension to reduce the horizontal space required for connections.
Data Source
AI summary
A MEMS microphone package is provided. The MEMS microphone package includes a substrate and a circuit device, the substrate has a conductive structure, and the circuit device has through silicon via structures that are electrically connected to the conductive structure. The MEMS microphone package also includes a sensor disposed on the substrate and having a connecting structure disposed on the bottom of the sensor. The connecting structure is electrically connected to the substrate and the circuit device. The MEMS microphone package further includes a cap covering the circuit device and the sensor and separated from the circuit device and the sensor.