MEMS Micro Mirror Dual-Side Electrode Lead-Out Grooves
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Solution Overview
Problem
Conventional MEMS micro mirrors and micro mirror arrays face challenges in testing, packaging, and application due to the difficulty in leading out electrodes from both sides, which hinders automation and flexibility in wafer-level testing.
Innovation Solution
A method for preparing a MEMS micro mirror with electrodes on both sides involves forming electrode lead grooves, insulating grooves, and comb plates on both sides of the micro mirror, allowing for electrical connection and easy integration of test probes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrodes are led out from the lower surface of the device, then wire bonding can be used for electrical connection, but automation of wafer-level micro mirror array testing is hindered
Solution Approach 1:
The patent introduces a new dimension for electrode lead-out by creating electrode lead grooves that extend from the lower protective layer through the substrate to the device layer surface. This allows electrodes to be accessed from both the lower surface (for wire bonding) and the upper surface (for automated testing probes), effectively adding a dimensional solution to the contradiction between manufacturing ease and testing automation.
2Ease of manufacture
If electrodes are fabricated on the upper surface of the device, then wire bonding can be used, but the structure becomes less flexible for testing
Solution Approach 1:
The patent makes the electrode structure universal by enabling it to serve multiple functions and be accessed from multiple surfaces. The electrode lead grooves allow the same electrode structure to be connected via wire bonding from the lower surface while also being accessible to automated testing probes from the upper surface, thus achieving multi-functionality and increased adaptability.
3Reliability
If reflectors and electrodes are located on the upper and lower surfaces respectively, then conventional electrode lead-out methods work, but customized test equipment is required
Solution Approach 1:
The patent enables the device structure itself to provide the necessary electrode access for testing without requiring external customized equipment. By incorporating electrode lead grooves that expose electrodes on the upper surface, the device becomes self-sufficient for automated testing, eliminating the need for specialized test equipment and reducing device complexity.
Data Source
AI summary
The present disclosure provides a method for preparing a MEMS micro mirror with electrodes on both sides. The method includes: providing a first base, forming an electrode lead groove in the first base; forming an insulating groove, a plurality of lower comb plates and a moving space groove in a first device layer to obtain a bonded structure layer; providing a second base bonded with the bonded structure layer to obtain a bonded piece; forming a frame, upper comb plates, movable micro light reflector, and elastic beams in a second device layer, with the movable micro light reflector located inside the frame, and the elastic beam connected with the frame and/or the movable micro light reflector; forming a metal reflecting layer, a first upper comb plate electrode, a first lower comb plate electrode, a second upper comb plate electrode and a second lower comb plate electrode.