MEMS Optical Beam Waveguide for Stacked Die Interconnects

The patent replaces conductor-based electrical connections with optical waveguide connections. The optical waveguides transmit data signals as light modulated by laser diodes, eliminating the need for high-power electrical conductors between stacked die modules. This substitution fundamentally changes the transmission medium from electrical to optical, resolving the power consumption and heat dissipation limitations of conductor-based systems while enabling higher communication density.

The patent changes the transmission parameter from electrical signals to optical signals. By modulating laser light at high frequencies, the system achieves bandwidths exceeding 100 Gbps, which is several orders of magnitude higher than conventional electrical connections. This parameter change enables both high-density communication and low-power operation simultaneously, as optical signals can carry more data with less energy consumption per bit compared to electrical signals at equivalent speeds.

The patent merges the optical transmission function directly into the chip structure by integrating waveguides within the semiconductor die. Instead of using external mirrors or deflectors, the waveguides are fabricated as part of the chip manufacturing process, combining the transmission medium with the circuit substrate. This integration eliminates external optical components while maintaining alignment flexibility through controlled waveguide routing and coupling structures.

The patent introduces optical waveguides as an intermediary structure that bridges the gap between optical sources and detectors within the chip. These waveguides serve as a controlled medium for light transmission, replacing the need for free-space optical coupling with external mirrors or deflectors. The waveguides provide a stable, integrated path for optical signals while enabling precise alignment through their fixed position within the chip architecture.

The patent performs alignment preparation during the chip fabrication process itself, before final assembly. Optical waveguides are pre-routed and pre-aligned within the semiconductor die using standard semiconductor manufacturing techniques. This preliminary action establishes precise optical paths in advance, eliminating the need for complex post-assembly alignment procedures and reducing manufacturing costs while maintaining high alignment precision.

The chip structure itself provides the alignment function through its rigid semiconductor substrate and integrated waveguide architecture. The waveguides are self-aligned to the chip features through photolithography and etching processes, using the chip's own structural elements as alignment references. This self-alignment capability eliminates the need for external alignment mechanisms and reduces manufacturing complexity while achieving tight alignment tolerances.