MEMS Package Design Reducing Side-Wall Width via Direct IC Bonding
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Solution Overview
Problem
Existing MEMS transducer packages face limitations in size and functionality due to the need for wide side walls and vias to accommodate electrical connections, which restrict the chamber size and integrated circuit footprint, making them unsuitable for space-constrained applications like earbuds.
Innovation Solution
A package design that eliminates the need for vias by providing a direct electrical connection between the integrated circuit and the upper region of the third member, allowing for a reduced side-wall width and increased chamber volume, enabling a larger integrated circuit footprint and enhanced functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If vias and wide side walls are used to accommodate electrical connections, then electrical connectivity is ensured, but the chamber size and integrated circuit footprint are restricted
Solution Approach 1:
The patent removes the via structure from the electrical connection path. Instead of routing electrical connections through vias in the side walls, the invention uses direct wire bonds from the integrated circuit to electrical contacts on the upper surface of the third member, eliminating the need for wide side walls and via holes, thereby increasing chamber volume.
Solution Approach 2:
The patent transitions electrical connections from a vertical through-wall path (via) to a direct upper-surface contact path. Electrical contacts are positioned on the upper surface of the third member, allowing wire bonds to connect directly without penetrating the side walls, effectively moving the connection point to a different spatial dimension.
2Length of stationary object
If wide side walls are used for electrical connections, then structural integrity is maintained, but the external package size increases
Solution Approach 1:
The via holes and associated wide side wall structures are removed from the design. Electrical connections are established through wire bonds to contacts on the upper surface, eliminating the need for wide side walls and reducing the overall package footprint while maintaining structural integrity.
3Reliability
If vias are used for electrical connections, then connectivity is achieved, but manufacturing complexity increases
Solution Approach 1:
The complex via fabrication process is eliminated. Instead of drilling, plating, and sealing via holes through the side walls, the invention uses simple wire bonding to electrical contacts on the upper surface, significantly simplifying the manufacturing process while maintaining reliable electrical connectivity.
Solution Approach 2:
The mechanical via fabrication process (drilling, plating, sealing) is replaced with a simpler wire bonding process. Electrical connections are made by bonding wires directly to contacts on the upper surface, avoiding the complex multi-step via fabrication sequence.
Data Source
AI summary
The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.