Non-Planar MEMS Package Port Design for Debris Protection
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Solution Overview
Problem
Existing MEMS device packages face challenges in providing adequate protection against dust, dirt, and mechanical damage while maintaining optimal acoustic performance and manufacturing efficiency, especially in compact electronic devices.
Innovation Solution
A package design featuring a non-planar portion on the lid or package base that extends a port through the cavity, with an attachment portion to receive the MEMS device, configured to prevent obstruction by attachment materials and ensure clear acoustic communication, using deformation techniques to create a guard or reservoir for the port.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a planar package design is used, then manufacturing is simple, but attachment materials can flow into the port and obstruct acoustic communication
Solution Approach 1:
The patent applies curvature by forming a non-planar portion (mound or depression) in the package base or lid at the port location. This curved surface prevents attachment materials from flowing directly into the port opening, thereby maintaining acoustic communication while using a relatively simple modified planar structure.
Solution Approach 2:
The non-planar portion acts as an intermediary barrier between the attachment materials and the port. This intermediate structure redirects material flow away from the port opening while maintaining the overall simplicity of the package design.
2Reliability
If the port is exposed directly to the environment, then acoustic transmission is clear, but the MEMS device is vulnerable to dust, dirt, and mechanical damage
Solution Approach 1:
The non-planar portion creates a curved protective barrier that shields the port and MEMS device from environmental contaminants while allowing sound waves to pass through the port opening. The curved geometry naturally directs dust and debris away from the vulnerable components.
3Reliability
If traditional manufacturing methods are used, then production is straightforward, but manufacturing complexity and cost increase with design modifications
Solution Approach 1:
The patent merges the protective function with the existing package base or lid structure by forming a non-planar portion during the same manufacturing process. This integration avoids adding separate protective components and maintains manufacturing simplicity while providing enhanced protection.
Solution Approach 2:
The invention changes the geometric parameter of the package base or lid from planar to non-planar at the port location. This parameter modification provides protective functionality using the same manufacturing techniques, avoiding the need for additional manufacturing steps or complex assembly processes.
Data Source
AI summary
A MEMS device for use in some embodiments in a microphone or pressure sensor and method of making the same wherein a portion of the package surrounding the acoustic port is deformed either away from, towards, or both away from and towards the interior of the package. By providing this raised area proximate the acoustic port, external debris is less likely to enter the acoustic port and damage the fragile MEMS die. Further, internal attachment material holding the MEMS die to the inside of the package is prevented by flowing into and obscuring the acoustic port. The advantages of this design include longer operation lifetimes for the MEMS device, greater design freedom, and increases in production yield.