MEMS Package Metallic Shielding Layer for EMI Reduction
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Solution Overview
Problem
There is a need for miniaturized MEMS components that can effectively shield against electromagnetic interference while being easy to produce, particularly for mobile communications devices where space constraints and electromagnetic noise are significant.
Innovation Solution
A MEMS package is designed with a mechanically stable carrier substrate, featuring a metallic shielding layer that covers the MEMS chip and chip component, forming a seal with the carrier substrate, and includes electrical connections to conductive structures for enhanced shielding, along with a structured thin-film or monolithic MEMS chip for sensor or actuator functions, and a laminate film enclosure for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional microphone housing with base plate and cap is used, then the MEMS component is enclosed and protected, but the overall structural size becomes large, limiting miniaturization
Solution Approach 1:
The patent merges the enclosure function with the carrier substrate by integrating the MEMS chip, chip component, and shielding layer directly onto a single substrate structure. This eliminates the need for separate base plates and caps, achieving miniaturization while maintaining protective enclosure functionality through the integrated substrate design.
Solution Approach 2:
The patent implements nesting by placing the MEMS chip and chip component directly on the carrier substrate, then covering them with a shielding layer that forms a seal with the substrate. This nested arrangement consolidates multiple functional layers into a compact vertical structure, reducing overall volume while maintaining protection and shielding.
2Volume of moving object
If the MEMS component is placed close to the antenna in mobile communications devices, then space is saved, but electromagnetic noise negatively influences component functioning
Solution Approach 1:
The patent introduces a metallic shielding layer as an intermediary between the MEMS chip/chip component and the external electromagnetic environment. This shielding layer, electrically connected to ground potential, acts as a mediator that blocks harmful electromagnetic waves from reaching the sensitive components, enabling close placement near antennas while maintaining functionality.
Solution Approach 2:
The shielding layer creates an electromagnetically inert environment around the MEMS chip and chip component by forming a sealed enclosure connected to ground potential. This inert electromagnetic atmosphere isolates the components from external electromagnetic interference, allowing compact device design with components positioned close to antennas.
3Object-affected harmful factors
If a metallic shielding layer is added to shield electromagnetic interference, then electromagnetic shielding is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent combines the shielding layer integration with the existing carrier substrate manufacturing process. The metallic shielding layer is deposited and connected to ground structures as part of the substrate fabrication sequence, merging the shielding function into the standard manufacturing flow rather than adding a separate complex assembly step.
Solution Approach 2:
The shielding layer is integrated into the carrier substrate during the manufacturing process before final assembly. By preparing the shielding structures and ground connections in advance during substrate fabrication, the patent simplifies subsequent assembly steps and reduces overall manufacturing complexity despite adding shielding functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact MEMS package with effective electromagnetic shielding, suitable for environments with electromagnetic interference, such as mobile radio terminals, while maintaining ease of production and integration with minimal overall height.
Implementation Method 1
A metallic shielding layer covers the MEMS chip and the chip component and forms a seal with the top side of the carrier substrate in an annular, closed peripheral region
Implementation Method 2
MEMS components (micro electro-mechanical systems), such as, e.g., microphones
Data Source
AI summary
A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.