MEMS Phase Shifter Bridge Structure to Reduce Adhesion Loss
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Solution Overview
Problem
Traditional phase shifters, such as ferrite and semiconductor phase shifters, face limitations in terms of power capability, insertion loss, power consumption, volume, and manufacturing cost, which restrict their large-scale application in communication and radar technologies.
Innovation Solution
A MEMS phase shifter is designed with a substrate, first and second wirings, an electrically conducting bridge, and isolating parts. The electrically conducting bridge intersects the first wiring and is lap-joined to the second wirings, with a first isolating part having a non-even surface close to the bridge, facilitating phase delay by changing the distributed capacitance of the Coplanar Waveguide transmission line.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If ferrite phase shifters are used, then power capability and insertion loss performance are improved, but volume, manufacturing cost, and process complexity increase
Solution Approach 1:
The patent replaces ferrite materials with MEMS (Micro-Electro-Mechanical Systems) technology, substituting a mechanical/ferrite-based phase shifting mechanism with an electrostatically actuated micro-bridge structure. This substitution maintains low insertion loss while dramatically reducing volume and simplifying manufacturing processes.
Solution Approach 2:
The patent changes the fundamental operating parameter from ferrite material properties to electrostatic capacitance control. By adjusting the position of the conductive bridge through electrostatic actuation, the phase shift is achieved through parameter changes in the transmission line characteristics rather than through ferrite material properties.
2Power
If ferrite phase shifters are used, then power capability is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent replaces complex ferrite processing with standard semiconductor-compatible MEMS fabrication techniques, including photolithography, sputtering, and electrostatic release. This substitution maintains high power capability while dramatically reducing manufacturing cost and process complexity.
Solution Approach 2:
The patent changes the approach from processing ferrite materials to fabricating micro-bridges using standard thin-film deposition and release processes. This parameter change in manufacturing approach reduces both cost and complexity while preserving power handling capabilities.
3Volume of stationary object
If semiconductor phase shifters are used, then volume and operating speed are improved, but power capability decreases and power consumption increases
Solution Approach 1:
The patent replaces semiconductor-based phase shifting with MEMS electrostatic actuation. This substitution achieves compact volume like semiconductor devices while restoring high power capability by using vacuum-gap capacitive structures that do not suffer from semiconductor breakdown limitations.
4Productivity
If the electrically conducting bridge is positioned close to the first wiring for phase delay, then phase shifting efficiency is improved, but the risk of adhesion between the bridge and isolating part increases
Solution Approach 1:
The patent applies surface roughness (micro-scale curvature/irregularity) to the isolating part surface facing the conductive bridge. This surface modification prevents adhesion by eliminating large flat contact areas, allowing the bridge to position closely for efficient phase shifting while maintaining reliability through reduced stiction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MEMS phase shifter achieves efficient phase delay with reduced insertion loss, power consumption, and volume, while improving manufacturing cost-effectiveness and stability by minimizing the risk of adhesion between the electrically conducting bridge and the isolating part.
Implementation Method 1
facilitating phase delay by changing the distributed capacitance of the Coplanar Waveguide transmission line
Implementation Method 2
a surface of one side of the first isolating part that is close to the electrically conducting bridge is not even
Data Source
AI summary
A phase shifter includes: a substrate; a first wiring and second wirings that are provided on one side of the substrate, wherein the second wirings are arranged on two opposite sides of the first wiring; at least one electrically conducting bridge, wherein the electrically conducting bridge and the first wiring intersect and are insulated from each other; and a first isolating part, wherein the first isolating part is provided on one side of the first wiring that is close to the electrically conducting bridge, and an orthographic projection on the substrate of a part of the electrically conducting bridge that intersects the first wiring is located within an orthographic projection of the first isolating part on the substrate; and a surface of one side of the first isolating part that is close to the electrically conducting bridge is not even.