MEMS Protruding Structure Height Uniformity via Lateral Conductive Layers

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Solution Overview

Problem

Micro-Electro-Mechanical Systems (MEMS) face challenges in achieving uniformity and sensitivity due to variations in the height of protruding structures, which affect the capacitance and reliability of MEMS devices like sensors and actuators.

Innovation Solution

The solution involves optimizing the height and placement of protruding structures in MEMS devices by using a combination of passivation layers and conductive layers to maintain a consistent height and reduce parasitic capacitance, thereby enhancing the uniformity and sensitivity of the devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the height of protruding structures is increased to improve sensitivity, then the sensitivity increases, but the uniformity deteriorates due to height variations

Engineering Contradiction:
ImprovesensitivityVSAvoiduniformity
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The patent introduces a horizontal dimension solution by using laterally extending conductive layers to compensate for vertical height variations. Instead of controlling the vertical height of protruding structures precisely, the conductive layers extend laterally to ensure that the top surfaces remain coplanar, effectively solving the uniformity problem through a dimensional shift from vertical to horizontal control.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent changes the control parameter from vertical height to lateral extension. By adjusting the lateral extent of conductive layers rather than the vertical height of protruding structures, the invention maintains coplanar top surfaces while allowing flexibility in the height of underlying structures, thus improving manufacturing precision without sacrificing sensitivity.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If passivation layers and conductive layers are added to maintain consistent height, then uniformity improves, but device complexity increases

Engineering Contradiction:
ImproveuniformityVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The conductive layers serve multiple functions: they provide electrical connectivity, maintain coplanar top surfaces for uniformity, and compensate for height variations in protruding structures. By making the conductive layers multi-functional, the patent achieves uniformity without adding dedicated structural elements, thus limiting the increase in device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The conductive layers act as intermediary elements between the protruding structures and the overlying layers. These intermediary layers absorb and compensate for height variations, ensuring that subsequent layers can be formed uniformly without directly modifying the complex underlying protruding structures, thus managing device complexity effectively.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in increased sensitivity and uniformity of MEMS devices by controlling the height of protruding structures, leading to improved performance and reliability in applications such as sensors and actuators.

Implementation Method 1

the height of the protruding structure affects the capacitance and reliability of MEMS devices

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS10273148B2Micro-electro-mechanical system and manufacturing method thereof
Publication Date: 2019.04.30 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US10273148B2 patent drawing
  • US10273148B2 patent drawing
  • US10273148B2 patent drawing

AI summary

Some embodiments of the present disclosure provide a microelectromechanical systems (MEMS). The MEMS includes a semiconductive block. The semiconductive block includes a protruding structure. The protruding structure includes a bottom surface. The semiconductive block includes a sensing structure. A semiconductive substrate includes a conductive region. The conductive region includes a first surface under the sensing structure. The first surface is substantially coplanar with the bottom surface. A dielectric region includes a second surface not disposed over the first surface.