MEMS Accelerometer Lateral Sensitivity via Segmented Sense Electrodes

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Solution Overview

Problem

MEMS accelerometers face challenges in achieving desired sensitivity as they shrink in size, leading to mechanical issues like deformation-induced contacts between components, which affect their performance.

Innovation Solution

The design incorporates additional sense electrodes or 'fingers' that partially extend across the opening between anchored and movable structures, enhancing capacitance and mechanical rigidity, thereby improving lateral sensitivity and reducing thermal noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If MEMS accelerometers are shrunk to reduce device size, then device miniaturization is achieved, but sensitivity deteriorates

Engineering Contradiction:
Improvedevice sizeVSAvoidsensitivity
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

The patent introduces additional sense electrodes (fingers) that extend laterally across the opening in the movable structure, utilizing the lateral dimension to increase capacitance. This dimensional approach allows sensitivity enhancement without increasing the vertical or overall device footprint, effectively resolving the contradiction between miniaturization and sensitivity maintenance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If MEMS accelerometers are designed to maximize sensitivity, then sensitivity is improved, but mechanical issues like deformation induced contacts occur

Engineering Contradiction:
ImprovesensitivityVSAvoidmechanical stability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent applies local quality by positioning additional sense electrodes (fingers) specifically in the lateral regions across the opening, rather than uniformly distributing capacitance-enhancing structures throughout the entire movable structure. This localized approach increases sensitivity in the critical sensing region while minimizing mechanical deformation and contact issues in other areas, thereby maintaining reliability.

Inventive Principle:
Principle #3Local quality

3Measurement precision

If additional sense electrodes are added to increase capacitance, then capacitive sensitivity is improved, but device complexity increases

Engineering Contradiction:
Improvecapacitive sensitivityVSAvoidstructure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent segments the sense electrode structure into multiple discrete fingers that extend laterally across the opening. This segmentation allows the capacitance-enhancing function to be distributed across multiple simple, identical elements rather than requiring a single complex structure. The repetitive finger geometry simplifies manufacturing while achieving the desired capacitance increase, thus resolving the contradiction between sensitivity improvement and structural complexity.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration increases capacitive sensitivity by up to 18% and maintains nearly identical relative linearity deviation compared to conventional designs, while providing improved structural rigidity and seismic mass.

Implementation Method 1

MEMS accelerometers react to acceleration with a change in electrical capacitance, which causes the output of an energized circuit, connected to the sensor, to vary

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS9612254B2Microelectromechanical systems devices with improved lateral sensitivity
Publication Date: 2017.04.04 STMICROELECTRONICS INT NV
  • US9612254B2 patent drawing
  • US9612254B2 patent drawing
  • US9612254B2 patent drawing

AI summary

Microelectromechanical system (MEMS) devices and methods for forming MEMS devices are provided. The MEMS devices include a substrate, an anchored structure fixedly coupled to the substrate, and a movable structure resiliently coupled to the substrate. The movable structure has an opening formed therethrough and is positioned such that the anchored structure is at least partially within the opening and is in a capacitor-forming relationship with the movable structure. The movable structure comprises a movable structure finger extending only partially across the opening.