MEMS Sensor Embedded Heater for Thermal Gradient Compensation

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Solution Overview

Problem

Portable electronic devices with MEMS pressure sensors face challenges in temperature sensitivity calibration, leading to inaccurate elevation measurements due to thermal gradients and mechanical strain, which existing technologies fail to address effectively.

Innovation Solution

An enhanced MEMS sensor device with an embedded heater, featuring an array of heating elements and a control feedback system to ensure uniform temperature distribution, which compensates for thermal gradients and mechanical strain by adjusting the drive current and power dissipation to maintain a specified temperature profile.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If temperature sensitivity calibration is performed without uniform heating, then calibration can be completed quickly, but measurement precision deteriorates due to thermal gradients and mechanical strain

Engineering Contradiction:
Improvetemperature sensitivity calibration accuracyVSAvoidheating control system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The heating system is divided into multiple independent heating elements arranged in an array across the substrate. Each heating element can be independently controlled to generate heat, allowing for localized temperature adjustment and uniform heat distribution across different regions of the MEMS sensor device.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A control system continuously monitors the temperature distribution across the MEMS sensor device and adjusts the drive current to each heating element in real-time. This feedback mechanism ensures uniform temperature maintenance by compensating for thermal gradients and preventing mechanical strain, thereby achieving precise temperature sensitivity calibration.

Inventive Principle:
Principle #23Feedback

2Measurement precision

If heating elements are added to achieve uniform temperature distribution, then temperature sensitivity calibration improves, but device complexity increases

Engineering Contradiction:
Improveelevation measurement accuracyVSAvoidarray of heating elements and control system
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The array of heating elements serves multiple functions: they provide uniform heating for temperature sensitivity calibration, maintain stable operating temperature during sensor operation, and prevent thermal gradients that could cause mechanical strain. This multi-functionality justifies the added complexity by delivering significant performance improvements in elevation measurement accuracy.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The control system dynamically adjusts the drive current parameters to each heating element based on real-time temperature feedback. By changing electrical parameters (current magnitude and distribution) rather than physical structure, the system achieves uniform temperature distribution and compensates for thermal effects, improving elevation measurement accuracy without requiring complex mechanical modifications.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides precise temperature sensitivity calibration and accurate elevation measurements by maintaining uniform heating across the MEMS sensor, reducing errors caused by thermal gradients and mechanical strain.

Implementation Method 1

The array of heating elements can be driven by a control system to uniformly heat the MEMS sensor device

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20230061188A1Enhanced MEMS sensor embedded heater
Publication Date: 2023.03.02 APPLE INC
  • US20230061188A1 patent drawing
  • US20230061188A1 patent drawing
  • US20230061188A1 patent drawing

AI summary

Aspects of the subject technology relate to an apparatus including a housing and a substrate. The apparatus further includes a sensor, an integrated circuit mounted on the substrate, and one or more heating elements configured to adjust a temperature of the sensor to facilitate measurement of temperature sensitivity and calibration of the sensor.