MEMS Sensor Heater for Post-Soldering Calibration
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Solution Overview
Problem
Existing sensors face performance degradation due to exposure to external environments like water and temperature variations, with pre-soldering calibration algorithms failing to address temperature coefficient offsets post-installation.
Innovation Solution
Integration of a MEMS heating element within the same layer as the deformable membrane, configured to generate heat for calibration and liquid evaporation, using trenches for electrical isolation and heat distribution, with materials like Silicon Nitride and Silicon Oxide in the trenches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If pre-soldering calibration algorithms are used to compensate for temperature effects, then temperature sensitivity is improved, but post-soldering temperature coefficient offset cannot be addressed
Solution Approach 1:
The patent applies preliminary action by integrating a calibration heater into the sensor structure before soldering, enabling post-soldering calibration to address temperature coefficient offsets that cannot be compensated by pre-soldering algorithms alone
Solution Approach 2:
The patent uses parameter changes by varying the temperature of the deformable membrane through the integrated heater during calibration, allowing measurement and compensation of temperature coefficient offsets at different temperature conditions
2Measurement precision
If the heating element is placed close to the deformable membrane for effective calibration, then calibration effectiveness is improved, but electrical isolation becomes more difficult
Solution Approach 1:
The patent uses an intermediary approach by introducing a dielectric layer between the heating element and the deformable membrane, providing electrical isolation while maintaining thermal coupling for effective calibration
Solution Approach 2:
The patent applies segmentation by separating the heating element from the deformable membrane through a dielectric layer, allowing independent electrical connections while maintaining functional coupling for heating and calibration purposes
3Adaptability or versatility
If the sensor is exposed to liquid environments for real-world operation, then operational versatility is improved, but liquid damage and performance degradation occur
Solution Approach 1:
The patent converts the harmful effect of liquid exposure by using the integrated heater to evaporate liquid from the deformable membrane, transforming the liquid contamination problem into a controllable thermal process that restores sensor performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective calibration of sensors post-soldering to address temperature coefficient offsets and removes liquid from the sensor environment, ensuring consistent performance across varying conditions.
Implementation Method 1
The MEMS heating element is configured to generate heat to heat up the deformable membrane
Implementation Method 2
a need has arisen to address and remove liquid from the sensor environment when liquid is detected
Data Source
AI summary
A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.