MEMS Sensor Package Assembly with Redistribution Layer and Cover Body
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Solution Overview
Problem
Conventional MEMS sensor packages face challenges in integrating more elements and functions into a smaller space, leading to bulkiness and increased costs, while struggling to meet demands for higher component density and efficient heat distribution.
Innovation Solution
A package assembly comprising a redistribution layer, moulding compound, and a cover body, which includes a redistribution layer with vias for electrical connections, a sensing element, and a moulding compound that encapsulates dies, providing structural support and heat distribution, while allowing for more elements to be packaged together and reducing volume and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more elements and functions are integrated into the sensor package, then the functionality and component density are improved, but the package volume increases making the sensor bulky
Solution Approach 1:
The patent implements nesting by placing the sensing element within a cavity of the housing structure, and incorporating the chip package within the element package. This nested arrangement allows multiple functional components to occupy overlapping or adjacent spatial zones, thereby integrating more elements without proportionally increasing the external package volume.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional packaging by introducing vertical stacking of packages (chip package on top of element package) and utilizing the depth dimension of the housing cavity. This dimensional change enables higher component density by exploiting the third dimension for spatial arrangement.
2Adaptability or versatility
If more elements are integrated into the package, then the component density is improved, but the manufacturing complexity and costs increase
Solution Approach 1:
The patent segments the sensor system into distinct functional modules: a chip package containing electronic components and a separate element package containing the sensing element. This segmentation allows each module to be manufactured and tested independently using optimized processes, then assembled together, thereby reducing overall manufacturing complexity while achieving high component density.
Solution Approach 2:
The housing structure serves multiple functions simultaneously: it provides mechanical protection for both packages, creates a cavity for the sensing element, provides a mounting surface for the chip package, and facilitates assembly through its integrated design. This multi-functionality reduces the need for additional components and simplifies manufacturing.
3Ease of manufacture
If conventional package structures are used, then the manufacturing process is simple, but the heat distribution efficiency deteriorates
Solution Approach 1:
The patent introduces a heat dissipation structure as an intermediary thermal management component. This structure acts as a thermal conduit between the heat-generating elements (chip and sensing element) and the external environment, efficiently distributing heat while being compatible with conventional manufacturing processes.
Data Source
AI summary
The present utility model discloses a package assembly of a sensor, comprising: a redistribution layer having a first face and a second face that are opposite to each other, and a first via that penetrates the first face and the second face; a first die electrically connected to the first face of the redistribution layer; a sensing element electrically connected to the first face of the redistribution layer; a cover body located between the redistribution layer and the sensing element, wherein the cover body has a second via that penetrates the cover body, and the second via communicates with the first via; and a moulding compound comprising a third face and a fourth face that are opposite to each other, wherein the moulding compound encapsulates the first die and the sensing element on the side of the first face of the redistribution layer, and the third face of the moulding compound is combined with the first face of the redistribution layer. The package assembly of the sensor allows more components to be packaged together, provides a better structural support and heat distribution, and reduces the volume and costs of the package assembly.