MEMS Sensor Temperature Stabilization via PCB Heating and Cooling

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Solution Overview

Problem

MEMS sensors used in antenna monitoring devices are prone to temperature drift, leading to inaccurate readings due to changes in temperature, which is particularly problematic in external environments.

Innovation Solution

A temperature stabilization system and method that includes heating and cooling components, such as resistance heating wires and Peltier devices, integrated into a printed circuit board (PCB) with MEMS sensors. Temperature sensors provide feedback to a processor, which controls the heating and cooling components to maintain a desired temperature range for the MEMS sensors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If MEMS sensors are deployed in external environments for antenna monitoring, then the device can perform alignment and tuning functions, but temperature drift causes inaccurate readings

Engineering Contradiction:
Improvesensor reading accuracyVSAvoidtemperature drift
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies parameter changes by actively modifying the temperature parameter of the MEMS sensor through heating and cooling components. Temperature sensors monitor the sensor's temperature, and the system adjusts temperature to maintain it within a stable range, thereby eliminating temperature drift and improving reading accuracy in external environments

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements feedback control by using temperature sensors to continuously monitor the MEMS sensor temperature and feeding this information back to the control system. The control system then adjusts heating and cooling components accordingly to maintain optimal temperature, ensuring accurate readings despite external environmental variations

Inventive Principle:
Principle #23Feedback

2Measurement precision

If heating and cooling components are added to stabilize temperature, then sensor accuracy improves, but device complexity increases

Engineering Contradiction:
Improvetemperature stabilityVSAvoidsystem structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges the temperature stabilization function with the existing antenna monitoring device structure. The heating and cooling components are integrated into the device housing, and temperature sensors are positioned within the existing circuit board layout, combining multiple functions into a unified system rather than adding separate independent modules

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system employs self-service by using the MEMS sensor's own temperature as the control parameter. Temperature sensors monitor the sensor's operating temperature directly, and the feedback control system automatically adjusts heating and cooling without requiring external intervention or complex manual calibration, simplifying the control architecture

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively stabilizes the temperature of MEMS sensors, reducing temperature-related inaccuracies and ensuring precise antenna alignment and tuning, even in varying environmental conditions.

Implementation Method 1

a resistance heating wire can be used as a heating component

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

a Peltier device may be used as a heating and or a cooling component

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Implementation Method 3

a temperature sensor configured to measure a temperature associated with the MEMS sensor

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250066187A1Temperature stabilization of micro electromechanical system sensors for antenna monitoring devices
Publication Date: 2025.02.27 VIAVI SOLUTIONS INC(US)
  • US20250066187A1 patent drawing
  • US20250066187A1 patent drawing
  • US20250066187A1 patent drawing

AI summary

Temperature stabilization systems and methods for MEMS sensors are disclosed. In an example, a temperature stabilization system may include heating and or cooling components within a printed circuit board (PCB) that holds a MEMS sensor. For example, a resistance heating wire can be used as a heating component and a Peltier device may be used as a heating and or a cooling component. Temperature sensors may be placed on the MEMS sensor itself and or the external environment and the measurements from the temperature sensors can be used to run a feedback loop to the keep the MEMS sensors within a desired temperature range through the use of the heating and or the cooling components.