MEMS Switch Enclosure Fabrication via Conductive Layer Merging

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Solution Overview

Problem

Miniaturized switches, such as MEMS devices, face challenges in protecting small moving parts from mechanical damage and environmental contaminants like moisture and humidity, leading to increased complexity and footprint in design and fabrication.

Innovation Solution

The development of a process for fabricating miniaturized switches with encapsulating enclosures involves selectively applying electrically-conductive material to form layers, including a ground plane, actuator, and enclosure, which are hermetically sealed to protect internal components from environmental factors, using a sequential build process that maintains electrical and mechanical isolation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If encapsulating enclosures are added to protect MEMS devices from mechanical damage and environmental contaminants, then reliability is improved, but device complexity and footprint increase

Engineering Contradiction:

Improveprotection from mechanical damage and environmental contaminantsVSAvoiddesign complexity and fabrication steps

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the enclosure structure with the electrical conductors and switch components into a single integrated three-dimensional microstructure. The enclosure walls are formed as continuous electrically-conductive surfaces that also serve as electrical conductors, eliminating the need for separate enclosure components and reducing overall device complexity while maintaining protection functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The electrically-conductive enclosure walls serve multiple functions simultaneously: they provide mechanical protection from environmental contaminants, act as electrical conductors for signal transmission, and form structural boundaries for the hermetically sealed volume. This multi-functionality reduces the number of separate components needed and simplifies the overall device design.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If encapsulating enclosures are added to protect MEMS devices, then reliability is improved, but the overall footprint of the switch increases

Engineering Contradiction:

Improveprotection from mechanical damage and environmental contaminantsVSAvoidoverall footprint of the switch

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent transitions from traditional two-dimensional planar layouts to three-dimensional vertical structures. The enclosure and electrical conductors are built upward in the vertical dimension using sequential deposition processes, allowing the device to achieve hermetic sealing and electrical functionality without increasing the horizontal footprint, thus maintaining a compact form factor.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If hermetic sealing is implemented to protect internal components, then reliability is improved, but electrical interconnection becomes difficult or unfeasible

Engineering Contradiction:

Improvehermetic sealing protectionVSAvoidelectrical interconnection feasibility

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the enclosure walls with the electrical conductor paths into a single continuous electrically-conductive structure. The enclosure walls themselves serve as the electrical conductors, allowing hermetic sealing to be achieved without compromising electrical interconnection capability. This integration eliminates the need for separate feedthroughs or connection points that would compromise the hermetic seal.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9613770B2Processes for fabricating MEMS switches and other miniaturized devices having encapsulating enclosures

Publication Date: 2017.04.04 HARRIS CORP

AI summary

Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).