Electrostatic/Electro-Adhesion Relays TRIZ Cases

A MEMS ohmic switch uses an off-center contact electrode and a secondary landing post to guide the movable plate into gentle contact.

In-line MEMS switches in a multichannel relay assembly reduce dispersive leakage while maintaining high power handling capabilities.

A capacitive RF MEMS switch uses a conductive metallic grating as a middle electrode to segment the device structure.

Nano-electromechanical relay switches form nonvolatile memory cells that retain data states without power.

A pooling electrode increases capacitance to lower the driving voltage while preventing stiction in RF MEMS switches.

Segmented bonding portions support conductor layers on a conductive base, reducing parasitic capacitance from SOI BOX electrification.

A MEM control circuit adjusts drive voltage based on sensor feedback to actuate the beam.

Segmenting MEMS switch contacts with a tear-off edge prevents uneven material buildup, resolving undefined contact forces.

A MEMS crosspoint switch converts optical signals to electrical ones for routing via an electrical array.

Segmented beams offset to a zero overlap position decouple pull-in voltage from standoff voltage.

Lateral offsetting the collapsible portion from maximum actuation liability reduces self-actuation risk under high-power RF signals.

A MEMS micro-switch array uses electrostatic actuation to interrupt current flow rapidly.

Galvanically isolated power circuitry propagates control signals unaffected by open switch voltage, enabling series stacking to achieve desired voltage ratings.

An AlN piezoelectric transformer amplifies weak RF signals to trigger a MEMS switch, reducing wake-up receiver power consumption to nanowatt levels.

Integrates MEMS switches and filters on bonded quartz and silicon substrates to maintain high quality factors in air without costly vacuum packaging.

Sequential switching between two parallel mechanical switches prevents contact erosion, maintaining signal quality in sensitive audio and video applications.

Gate circuitry shapes the temporal distribution of gating signals across a MEMS switching array to reduce inductive voltage surges during current interruption.

Local and cavity diodes provide forward-biased paths to neutralize excess charge, preventing snapdown damage in voltage controlled MEMS devices.

Asymmetrical comb electrode structures with varying gap distances drive vibration amplitude in energy harvesters.

Digital MEMS logic controls high voltage using serial switch pairs, reducing power loss in crossbar switches.

A spacer electrode portion maintains the same potential as movable electrodes to prevent charge accumulation and stiction on insulating films.

A MEMS switch uses a stress gradient to deflect its switching assembly between contacts for tri-state operation.

High-resistance regions on movable and fixed electrodes suppress current leakage and sticking, enabling low-voltage driving without increasing device size.

Secondary landing contacts and plate bend structures maintain uniform contact with a conductive RF plateau, reducing charge build-up in the dielectric layer.

Electrostatic MEMS switches perform arc-less operations at zero crossings, eliminating transient overvoltages and contactor damage from fault currents.

Capacitively-coupled contacts eliminate high-temperature annealing, preventing material degradation while maintaining low contact resistance.

Segmented gas chambers minimize squeeze film damping and stabilize oscillations to reduce settling times in MEMS switches.

Conductive enclosure walls merge with electrical conductors to protect internal components from moisture while reducing device complexity.

Isolated p-wells or n-wells coupled to RF ground shields reduce substrate resistance influence and noise coupling in MEMS digital variable capacitors.

Routing current through the substrate thickness eliminates surface traces, boosting packing density and current capacity.

Multiple springs engage at specific displacement points to boost release voltage without raising pull-in voltage, enabling reliable RF hot switching.

Segmented counter electrodes apply sequential voltage to generate mechanical cleaning, reducing oxide-induced contact resistance and stiction.

Vertical electrode stacking reduces driving voltage while maintaining compact size and preventing short circuits.

Hermetically sealing platinum-series MEMS contacts maintains conductivity through controlled oxidation.

A MEMS switch contact member joins signal line edges to boost restoring force and minimize sticking failures.

Intra-cavity routing reduces parasitic capacitance in MEMS variable capacitors by utilizing CMOS back-end metallization layers.

MEMS switches tune capacitance in multi-layer packages to reduce silicon die area and power consumption while maintaining high-speed switching performance.

Segmenting the MEMS switch into weak and strong spring force beams resolves the contradiction between high-speed operation and low driving voltage requirements.

A mirror substrate affixed to a partially released MEMS member balances the center of mass through strategic mass distribution.

Substrate recesses reduce electrostatic stress and charging to prevent device stiction.

Integrating the anchor with the sealing layer prevents cantilever breakage at the attachment point.

Segmented hinge sections guide beam deflection to prevent unwanted contact with RF stacks, resolving manufacturing yield issues in small devices.

Segmented anchor voids accommodate thermal expansion, reducing mechanical stress and preventing electrical short-circuits in MEMS devices.

Inert atmosphere filling prevents ohmic contact degradation and dielectric formation, maintaining capacitive values.

A MEMS switch integrates with control circuitry to interrupt electrical current paths rapidly.

A MEMS driving member uses suspending beams to switch electrical contacts.

Segmented optical channels with automated switching eliminate sensor exchange delays during coordinate measurement tasks.

Light-shielding resin with light-blocking portions intercepts stray radiation, preventing false detection from large incident angles.

A nanocrystalline graphite coated electromechanical relay reduces stiction and micro-welding between contacts.