MEMS Wafer Level Packaging Using Polymer Films
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Forming a hermetically sealed package for MEMS devices with a cavity, or headspace, at a desired cost is challenging in existing technologies.
Innovation Solution
A method involving the application of a lower polymer film to form headspace walls around MEMS devices on a common substrate, followed by patterning an upper polymer dry film to create headspace caps, which isolate components and allow for singulation and subsequent encapsulation, ensuring hermetic sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging methods are used for MEMS devices, then hermetic sealing can be achieved, but the cost and complexity increase significantly
Solution Approach 1:
The patent combines the headspace wall formation and hermetic sealing functions into a single integrated polymer film structure. The lower polymer film forms both the headspace wall and provides hermetic sealing simultaneously, eliminating the need for separate sealing components and reducing packaging complexity while maintaining reliability
Solution Approach 2:
The polymer film structure serves multiple functions: it acts as the headspace wall boundary, provides hermetic sealing from the external environment, and supports the MEMS device components. This multi-functional approach reduces the number of separate components needed and simplifies the overall packaging structure
2Reliability
If conventional packaging methods are used for MEMS devices, then hermetic sealing can be achieved, but the manufacturing cost increases
Solution Approach 1:
By merging the headspace wall and hermetic seal into a single polymer film layer, the patent reduces the number of manufacturing steps and materials required. This integration lowers manufacturing cost while maintaining the hermetic sealing function through the continuous polymer film structure
3Productivity
If components are isolated during singulation, then device separation is achieved, but protection during the process is reduced
Solution Approach 1:
The headspace wall and cap structures are formed beforehand to isolate and protect the MEMS device components before singulation occurs. This preliminary packaging structure shields the components during the singulation process, maintaining protection while enabling efficient device separation
Data Source
AI summary
A MEMS device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of MEMS devices, and patterning the lower polymer film to form a headspace wall surrounding components of each MEMS device. Subsequently an upper polymer dry film is applied to top surfaces of the headspace walls and patterned to form headspace caps which isolate the components of each MEMS device. Subsequently, the MEMS devices are singulated to provide separate MEMS devices.