Mesh Semiconductor Layer for Foldable Display Reliability
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Solution Overview
Problem
Display devices with flexible substrates face mechanical reliability issues due to high modulus of elasticity, leading to potential damage of semiconductor layers during deformation such as bending or folding.
Innovation Solution
A display device with a semiconductor layer featuring a mesh structure and multiple openings in the thickness direction, along with a buffer layer, gate insulating layer, and interlayer insulating layer, which are in direct contact through these openings, enhances mechanical reliability by reducing stress and preventing crack propagation during deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate is used to enable deformation, then adaptability is improved, but the semiconductor layer is damaged due to high modulus of elasticity
Solution Approach 1:
The semiconductor layer is divided into a mesh structure with multiple openings, segmenting the continuous layer into a network of connected regions. This segmentation allows the layer to deform flexibly while maintaining structural integrity, as the openings accommodate stress during bending and folding without causing crack propagation throughout the entire layer.
Solution Approach 2:
The semiconductor layer is designed with a porous mesh structure containing multiple openings that penetrate through the layer. This porous configuration reduces the modulus of elasticity and enables the layer to withstand deformation forces, allowing the display device to be bent or folded without damaging the semiconductor layer.
2Reliability
If a mesh structure with openings is used in the semiconductor layer, then mechanical reliability is improved, but manufacturing precision may be affected
Solution Approach 1:
The semiconductor layer is formed as a mesh structure by dividing the continuous layer into segmented regions connected by thin bridges, with openings positioned at regular intervals. This segmentation approach maintains manufacturing precision through standardized patterns while enabling the mechanical flexibility needed for deformable displays.
Solution Approach 2:
The semiconductor layer's physical parameters are changed by introducing a mesh structure with controlled opening sizes, spacing, and connectivity. This parameter modification transforms the layer from a rigid continuous structure to a flexible mesh, improving mechanical reliability while maintaining controllable manufacturing precision through defined geometric parameters.
Data Source
AI summary
A display device includes a substrate and a transistor disposed on the substrate and including a semiconductor layer, wherein the semiconductor layer includes a mesh structure, and wherein a plurality of openings are formed in the semiconductor layer.