Mesh Wiring Layers for Thin Differential Signal Semiconductor Packaging
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Solution Overview
Problem
The use of thin polyimide films as insulating layers in semiconductor devices leads to issues with adhesive reliability and flatness of conductive patterns, resulting in peeling problems during manufacturing and mounting, which complicates the formation of differential signal wirings and increases the thickness of the semiconductor device.
Innovation Solution
A semiconductor device design featuring multiple wiring layers with conductive patterns covered by polyimide films, where the second and third wiring layers are arranged between the first layer and have mesh patterns with overlapping opening portions to enhance adhesion and reduce surface unevenness, thereby improving the reliability and flatness of the polyimide films and conductive patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a thin polyimide film is used as an insulating layer to reduce device thickness, then the device thickness is reduced, but the adhesive reliability between the polyimide film and conductive pattern deteriorates
Solution Approach 1:
The conductive pattern is segmented into a mesh pattern with multiple opening portions, which divides the continuous conductive layer into discrete regions. This segmentation increases the total perimeter length of the conductive pattern that contacts the polyimide film, thereby enhancing adhesive reliability even with thin polyimide films.
Solution Approach 2:
The conductive pattern is designed with mesh structures at specific locations where adhesive reinforcement is needed. The mesh pattern creates localized contact points between the conductive pattern and polyimide film, concentrating adhesion forces at critical interfaces while maintaining overall thin film structure.
2Length of stationary object
If a thin polyimide film is used as an insulating layer to reduce device thickness, then the device thickness is reduced, but the flatness of the conductive pattern deteriorates
Solution Approach 1:
The conductive pattern is divided into a mesh structure with multiple opening portions that penetrate through the conductive pattern. This segmentation allows the polyimide film to maintain better contact with the substrate and underlying layers, reducing surface unevenness and improving flatness even when using thin polyimide films.
Solution Approach 2:
The invention uses a composite structure combining the polyimide film with the mesh-patterned conductive pattern. The mesh structure acts as a reinforcing framework that helps maintain the flatness of the thin polyimide film surface, creating a composite system with improved dimensional stability.
3Ease of manufacture
If the conductive pattern is formed on the polyimide film, then the wiring function is achieved, but peeling occurs between the polyimide film and conductive pattern
Solution Approach 1:
The conductive pattern is segmented into a mesh structure with multiple opening portions, which increases the surface area and perimeter contact between the conductive pattern and polyimide film. This segmentation creates multiple bonding interfaces that resist peeling forces, preventing delamination while maintaining wiring functionality.
Solution Approach 2:
The conductive pattern is designed with a three-dimensional mesh structure that penetrates through the polyimide film thickness direction. This dimensional change creates interlocking bonds between the conductive pattern and polyimide film, significantly enhancing peeling resistance through mechanical interlocking in addition to adhesive bonding.
Data Source
AI summary
A semiconductor device comprising a wiring member with which a semiconductor chip is electrically connected including: a first wiring layer having a plurality of first conductive patterns; a second wiring layer arranged next to the first wiring layer in a thickness direction of the wiring member, and having a second conductive pattern; and a third wiring layer arranged next to the second wiring layer in the thickness direction of the wiring member, and having a third conductive pattern. Here, in plan view, a first opening portion of each of two, which are arranged next to each other, of a plurality of first opening portions each penetrating through the second conductive pattern is overlapped with a pair of differential signal wirings contained in plurality of first conductive patterns, and is overlapped with two or more of a plurality of second opening portions each penetrating through the third conductive pattern.