Magnetoelectric Spin Orbit Logic Transistor with Spin Filter

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Solution Overview

Problem

Conventional Metal Oxide Semiconductor (MOS) Field Effect Transistors face limitations in down-scaling gate voltage due to thermal effects, and Tunneling Field Effect Transistors have high on/off ratios and integration challenges in CMOS process technology, while Magnetoelectric Spin Orbit Logic (MESO) devices require lower gate voltages for efficient operation.

Innovation Solution

A magnetoelectric spin orbit logic transistor with a spin filter is developed, utilizing a stack of transition metal dichalcogenides and magnetic insulators as source and drain regions, and a magneto-electric oxide as gate oxide, allowing for lower gate voltage operation and high ON/OFF ratios, compatible with CMOS process technology.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional MOSFET is used, then device structure is simple and easy to manufacture, but gate voltage cannot be scaled down below thermal limit

Engineering Contradiction:
Improvegate voltageVSAvoiddevice structure
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent employs composite material structures including magnetic insulator layers (e.g., EuO, EuS), transition metal dichalcogenide layers (e.g., MoS2, MoSe2), and ferroelectric materials (e.g., Pb(Zr,Ti)O3) stacked together to form the transistor. This composite structure enables magnetoelectric coupling that allows gate voltage scaling below thermal limits while maintaining manufacturability through established thin-film deposition techniques.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent replaces the conventional electric field-based control mechanism in MOSFETs with a magnetoelectric coupling mechanism. The magnetic insulator layer mediates the interaction between electric field (from gate) and magnetic moment (in channel), enabling voltage control of current through magnetic moment alignment rather than direct electric field effect, thus achieving sub-thermal voltage operation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If TFET is used, then gate voltage can be scaled down, but on/off ratio is high and integration in CMOS process is challenging

Engineering Contradiction:
ImproveCMOS integrationVSAvoidon/off ratio
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent designs the magnetoelectric transistor with a universal structure that can be integrated into CMOS processes. The magnetic insulator/transition metal dichalcogenide stack serves multiple functions: as the active channel, as the source/drain regions, and as the switching element. This multi-functionality simplifies the overall device structure and enables seamless integration with existing CMOS fabrication processes while maintaining high on/off ratios through magnetoelectric switching.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent introduces localized magnetic moments in the channel region through the magnetic insulator layer, creating spatially varying magnetic properties that enable high on/off ratio. The magnetic moment alignment in the channel region, controlled by the gate voltage through magnetoelectric coupling, provides localized control over carrier transport, achieving superior switching characteristics while remaining compatible with CMOS integration.

Inventive Principle:
Principle #3Local quality

3Use of energy by moving object

If MESO device is used, then energy dissipation is reduced, but device has more than three terminals making integration challenging

Engineering Contradiction:
Improveenergy dissipationVSAvoidnumber of terminals
Core Design Contradiction:
Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The patent merges the gate control function with the magnetoelectric coupling function into a single three-terminal structure. The gate electrode applies electric field that couples through the magnetic insulator layer to control magnetic moment alignment in the channel, enabling voltage-controlled switching with only three terminals (source, drain, gate). This integration of functions maintains the low energy dissipation advantage of MESO devices while achieving standard three-terminal compatibility for easy integration.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The magnetoelectric spin orbit logic transistor achieves lower gate voltage operation (down to 100 mV) with high ON/OFF ratios, facilitating easier integration and reduced power consumption for logic computation, neuromorphic computing, and memory operations.

Implementation Method 1

MESO devices use magnetoelectric (ME) effect to manipulate magnetization (and associated spin of electrons in a material) by an applied electric field

Methodology Applied
Scientific EffectMagnetoelectric effect: Magnetoelastic Effects

Implementation Method 2

a stack of transition metal dichalcogenides and magnetic insulators as source and drain regions

Methodology Applied
Scientific EffectSpin filtering:

Data Source

PatentUS11398562B2Magnetoelectric spin orbit logic transistor with a spin filter
Publication Date: 2022.07.26 INTEL CORP
  • US11398562B2 patent drawing
  • US11398562B2 patent drawing
  • US11398562B2 patent drawing

AI summary

An apparatus is provided which comprises: a first stack comprising a magnetic insulating material (MI such as, EuS, EuO, YIG, TmIG, or GaMnAs) and a transition metal dichalcogenide (TMD such as MoS2, MoSe2, WS2, WSe2, PtS2, PtSe2, WTe2, MoTe2, or graphene; a second stack comprising an MI material and a TMD, wherein the first and second stacks are separated by an insulating material (e.g., oxide); a magnet (e.g., a ferromagnet or a paramagnet) adjacent to the TMDs of the first and second stacks, and also adjacent to the insulating material; and a magnetoelectric material (e.g., (LaBi)FeO3, LuFeO3, PMN-PT, PZT, AlN, or (SmBi)FeO3) adjacent to the magnet.