Metal Carrier with Compensating Layer for Semiconductor Strain Control
Solution Overview
Problem
Components without molded bodies often experience unwanted deformations due to internal mechanical strains, leading to processing difficulties and reduced yield, especially in semiconductor wafers which can roll up, making them challenging to manufacture into components with high mechanical stability and low overall height.
Innovation Solution
A component design featuring a metallic carrier layer with a contiguous mirror layer and a compensating layer adjacent to it, which are formed to have opposite strains, ensuring the component is mechanically stable and free of distortion, along with a method of manufacturing that includes forming a stabilization layer and a compensation layer on a semiconductor wafer to counteract internal mechanical strains during singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a component without a molded body uses a metallic carrier, then the overall height is reduced and mechanical stability is improved, but internal mechanical strains cause unwanted deformations and rolling of the semiconductor wafer
Solution Approach 1:
The patent applies composite materials by combining the metallic carrier layer with a compensating layer made of different material properties. This composite structure allows the carrier to provide mechanical stability while the compensating layer counteracts internal strains, preventing wafer distortion and rolling during manufacturing and operation.
2Ease of manufacture
If internal mechanical strains are present in the metallic carrier, then manufacturing is simplified, but yield is reduced due to wafer rolling and processing difficulties
Solution Approach 1:
The compensating layer is designed to apply preliminary counteracting forces against the internal mechanical strains in the metallic carrier. By pre-configuring this compensation mechanism, the system prevents wafer rolling and processing issues before they occur, thereby maintaining high manufacturing yield while keeping the carrier structure simple.
3Length of moving object
If the carrier provides high mechanical stability, then the component maintains low overall height, but internal strains cause processing difficulties
Solution Approach 1:
The patent applies local quality by introducing a compensating layer with specific material properties at the interface between the metallic carrier and semiconductor wafer. This localized compensation mechanism addresses internal strains only where they occur, maintaining the low overall height of the component while eliminating processing difficulties caused by wafer distortion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a component with high mechanical stability and low overall height, preventing semiconductor wafers from rolling up and ensuring they are strain-free, thus simplifying the manufacturing process and increasing yield.
Implementation Method 1
the carrier has a compensating layer directly adjacent to the carrier layer and configured to compensate for internal mechanical strains in the component
Implementation Method 2
the carrier includes a mirror layer disposed between the semiconductor body and the carrier layer
Data Source
AI summary
A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body includes a semiconductor layer facing away from the carrier, a further semiconductor layer facing the carrier and an optically active layer located therebetween, the carrier has a metallic carrier layer that is contiguous and mechanically stabilizes the component, the carrier includes a mirror layer disposed between the semiconductor body and the metallic carrier layer, the carrier has a compensating layer directly adjacent to the metallic carrier layer and is configured to compensate for internal mechanical strains in the component, and the compensating layer is arranged between the semiconductor body and the metallic carrier layer.