Metal-Ceramic Substrate Bonding for Longer Lateral Terminals
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Solution Overview
Problem
Existing methods for producing metal-ceramic substrates with laterally projecting terminals are inefficient and yield low-quality results, as they require significant mechanical force or are difficult to automate, limiting the production of larger formats and longer terminals.
Innovation Solution
A method involving a ceramic and metal layer bonding process where a materially bonded connection is dispensed with in certain regions, allowing the ceramic and metal layers to extend differently, enabling the metal layer to project laterally as a terminal without peeling or strip techniques, and allowing for flexible terminal orientation and longer terminal production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If mechanical peeling method is used to produce terminals, then terminals can be realized, but only relatively small terminals can be produced and a considerable amount of force is required with low yield
Solution Approach 1:
The substrate is divided into multiple sections with different bonding characteristics: a first section where the metal layer is bonded to the substrate, and a second section where the metal layer is not bonded, allowing selective separation to create terminals of various sizes without mechanical peeling
Solution Approach 2:
The metal layer is selectively bonded or left unbonded in different regions before the final terminal formation step, allowing terminals to be created simply by separation without requiring forceful mechanical peeling operations
2Ease of operation
If strip technique is used to realize terminals, then terminals can be produced, but metal-ceramic substrates cannot be produced in large card format and production is difficult to automate
Solution Approach 1:
The substrate is divided into multiple sections with different bonding characteristics: a first section where the metal layer is bonded to the substrate, and a second section where the metal layer is not bonded, allowing selective separation to create terminals of various sizes without mechanical peeling
Solution Approach 2:
The selective bonding process can accommodate various terminal configurations and substrate formats (including large card formats) using the same basic process steps, making the method universally applicable and easy to automate
3Strength
If metal layer is bonded to ceramic layer in all regions, then strong bonding is achieved, but terminals cannot be formed without peeling or strip techniques
Solution Approach 1:
The bonding between metal layer and substrate is made non-uniform: in a first region the metal layer is bonded to the substrate providing strong mechanical strength, while in a second region the metal layer is not bonded allowing easy separation to form terminals without compromising overall bonding strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances production efficiency and yield, enabling the creation of larger metal-ceramic substrates with longer, flexible terminals that can be adapted for various applications, reducing the risk of damage and eliminating the need for additional structuring steps.
Implementation Method 1
bonding the metal layer to the ceramic layer region by region to form a first region, which has a materially bonded connection between the metal layer and the ceramic layer
Data Source
AI summary
Method of manufacturing a metal-ceramic substrate (1) which, in the finished state, has a ceramic layer (11) and a metal layer (12) extending along a main extension plane (HSE) and arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE) comprising providing the metal layer (12) and the ceramic layer (11) and bonding the metal layer (12) to the ceramic layer (11) in regions to form a first region (B1), which has a materially bonded connection between the metal layer (12) and the ceramic layer (11), and a second region (B2), in which the metal layer (12) and the ceramic layer (11) are arranged one above the other without a materially bonded connection, as seen in the stacking direction (S).