Metal-Ceramic Module With Integrated Frame For Component Mounting
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Solution Overview
Problem
Existing metal-ceramic substrates for high-voltage electrical and electronic circuits face challenges in heat dissipation and component integration, particularly in high-voltage applications, where drilling through ceramics can damage the substrate and metallization of pocket holes with different depths is complex.
Innovation Solution
A power-electronic metal-ceramic module is created with a metal frame that accommodates electronic components, allowing for lamination without drilling through the ceramic, providing uniform pressure and enhanced heat spreading, and enabling a symmetrical layer structure with improved electrical insulation and heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If drilling is performed through the ceramic substrate to integrate components, then component integration is achieved, but the ceramic substrate is damaged and manufacturing complexity increases
Solution Approach 1:
The invention divides the integration process into two separate stages: first, components are mounted on the metal frame; second, the assembled frame-component unit is attached to the ceramic substrate. This segmentation avoids drilling through the ceramic, preserving its integrity while achieving component integration.
Solution Approach 2:
The metal frame is prepared in advance with component mounting areas, and components are pre-assembled on the frame before the frame is attached to the ceramic substrate. This preliminary action eliminates the need for post-ceramic-drilling component installation.
2Ease of manufacture
If drilling through the ceramic substrate is performed, then component mounting is enabled, but manufacturing complexity and risk of damage increase
Solution Approach 1:
The manufacturing process is segmented into independent steps: metal frame fabrication with component mounting, separate ceramic substrate preparation, and final assembly. This eliminates complex drilling operations through the ceramic and reduces overall manufacturing complexity.
Solution Approach 2:
The metal frame serves as an intermediary component that provides a mounting platform for electronic components. This intermediary approach allows component attachment without direct drilling into the ceramic substrate, simplifying the manufacturing process.
3Strength
If pressure is applied during lamination, then bonding is achieved, but non-uniform pressure distribution causes ceramic damage
Solution Approach 1:
The metal frame provides a uniform, flat bonding surface that distributes lamination pressure evenly across the ceramic substrate. This homogeneous pressure distribution prevents localized stress concentrations that could damage the ceramic while ensuring adequate bonding strength.
4Ease of manufacture
If asymmetrical layer structure is used, then component placement is simplified, but electrical insulation and heat conduction are compromised
Solution Approach 1:
The invention employs an asymmetrical layer structure where the metal frame is positioned only on one side of the ceramic substrate. This asymmetry simplifies component placement while the metal frame itself provides the necessary electrical insulation and heat conduction functions.
Solution Approach 2:
The metal frame is strategically positioned to provide localized electrical insulation and heat conduction where needed, rather than requiring symmetrical layers throughout the entire structure. This local quality approach maintains reliability while enabling manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the production of power-electronic metal-ceramic modules for high-voltage applications, reducing the risk of ceramic damage, facilitating better heat management, and offering efficient electrical insulation and heat conduction while allowing for symmetrical layer structures and uniform contact options.
Implementation Method 1
offering efficient electrical insulation and heat conduction
Implementation Method 2
In the present case, in particular sintering, soldering, diffusion soldering, or the like come into consideration as possible joining processes
Implementation Method 3
In the present case, in particular sintering, soldering, diffusion soldering, or the like come into consideration as possible joining processes
Data Source
AI summary
A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).