Metal-Ceramic Substrate Bonding Layer Sheet Resistance
Solution Overview
Problem
Existing metal-ceramic substrates require significant manufacturing effort for interconnections, which can be time-consuming and costly.
Innovation Solution
A metal-ceramic substrate with a bonding layer having a sheet resistance greater than 5 ohm/sq, formed during the manufacturing process by bonding a metal layer to a ceramic element, allowing for simultaneous bonding and interconnection formation without additional work steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate interconnection formation steps are used in metal-ceramic substrates, then reliable electrical connections are achieved, but manufacturing time and cost increase significantly
Solution Approach 1:
The patent merges the bonding layer formation and interconnection formation into a single integrated process step. The bonding layer itself is structured to serve dual functions: bonding the metal layer to the ceramic element and providing electrical interconnections through conductive regions within the bonding layer, thereby eliminating separate interconnection formation steps and reducing manufacturing complexity
Solution Approach 2:
The bonding layer is designed with multi-functionality, serving both as an adhesive bonding agent between metal and ceramic layers and as an electrical interconnection medium. By incorporating conductive regions directly into the bonding layer structure, it performs multiple functions simultaneously, reducing the number of required process steps and improving manufacturing efficiency
2Reliability
If additional work steps are added for interconnection formation, then electrical interconnections are achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple functions into the bonding layer: mechanical bonding between layers and electrical interconnection. The bonding layer includes both adhesive regions for bonding and conductive regions for electrical connections, integrating what would traditionally require separate process steps into a single unified structure
Solution Approach 2:
The bonding layer is configured in advance with both bonding functionality and interconnection functionality built-in. The conductive regions are pre-positioned within the bonding layer structure, so that when the bonding layer is applied, both bonding and interconnection functions are simultaneously established without requiring subsequent additional work steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing time and cost by integrating interconnection formation with the bonding process, while achieving the necessary electrical and thermal performance for power electronics applications.
Implementation Method 1
a bonding layer is formed in the manufactured metal-ceramic substrate between the at least one metal layer and the ceramic element
Implementation Method 2
a bonding agent layer of the bonding layer has a sheet resistance which is greater than 5 ohm/sq
Data Source
AI summary
A metal-ceramic substrate (1) as a carrier for electrical components, in particular in the form of a printed circuit board, comprisinga ceramic element (20) andat least one metal layer (10, 20), wherein the at least one metal layer (10) and the ceramic element (30) extend along a main extension plane (HSE) and are arranged on top of one another along a stacking direction(S) running perpendicular to the main extension plane (HSE),wherein a bonding layer (12) is formed in the manufactured metal-ceramic substrate (1) between the at least one metal layer (10, 20) and the ceramic element (30), andwherein a bonding agent layer of the bonding layer (12) has a sheet resistance which is greater than 5 ohm/sq, more preferably greater than 10 ohm/sq and most preferably greater than 20 ohm/sq, wherein an interconnection (15) is formed in the ceramic element (30).