Metal Circuit Board Insulating Layer Thermal Expansion Control
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Solution Overview
Problem
Conventional metal-based circuit boards experience warpage and distortion due to thermal expansion differences between the metal base, insulating layer, and printed circuit, leading to reliability issues with component connections and multilayer circuit design.
Innovation Solution
A metal-based circuit board structure featuring a three-layer insulating system with alternating thermal expansion coefficients, where the first and second conductor layers are separated by a middle insulating layer with a larger expansion coefficient, and additional insulating layers with smaller coefficients on either side of the substrate, reducing thermal stress and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a metal plate base is used to provide higher heat dissipation capacity, then heat dissipation capacity is improved, but distortion and warpage develop due to thermal expansion differences between the metal plate, insulating layer, and printed circuit
Solution Approach 1:
The patent changes the physical parameters of the insulating layers by selecting materials with specific coefficients of thermal expansion. The first insulating layer has a coefficient closer to the metal plate, while the second insulating layer has a coefficient closer to the printed circuit, creating a gradient that accommodates thermal expansion differences and prevents warpage while maintaining heat dissipation
Solution Approach 2:
The patent uses a composite structure with two different insulating layers having different coefficients of thermal expansion. This composite insulating system bridges the thermal expansion gap between the metal plate base and the printed circuit, allowing the metal plate to maintain its heat dissipation advantage without suffering from distortion and warpage
2Adaptability or versatility
If a multilayered printed circuit is formed to increase design freedom, then degree of freedom for circuit design is improved, but distortion or warpage of the substrate develops easily and disconnection may occur
Solution Approach 1:
The patent modifies the thermal expansion parameters of the insulating layers to match the intermediate values between the metal plate and printed circuit. This parameter optimization allows multilayered circuits to be formed without excessive warpage or disconnection, maintaining both design freedom and connection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively minimizes warpage and enhances heat dissipation, improving connection reliability and design flexibility for multilayer circuits while maintaining bonding strength between layers.
Implementation Method 1
coefficient of thermal expansion of the first intermediate insulating layer is larger than that of the second intermediate insulating layers
Data Source
AI summary
A metal-based circuit board, which reduces the influence of thermal expansion, is provided having a structure where an insulating layer A having a large coefficient of thermal expansion is sandwiched between insulating layers B having a small coefficient of thermal expansion. Such a structure allows the insulating layers B to contract and expand so as to suppress contraction and expansion of the insulating layer A and thereby reduce the stress in the direction of negating the stress. As a result, while warpage or distortion is suppressed to be minimal, the bonding strength of the upper and the lower layer is maintained, and degree of freedom for circuit design is not impaired, thereby providing a highly reliable circuit structure.